Sunday, June 21, 2026
FlexiblesAshok Chaturvedi highlights AI’s role in tackling flexible packaging...

Ashok Chaturvedi highlights AI’s role in tackling flexible packaging waste at ElitePlus

-

Ashok Chaturvedi highlights AI’s role in tackling flexible packaging waste at ElitePlus

-

Ashok Chaturvedi, founder, chairman, and managing director, UFlex Group, delivered a pivotal keynote address highlighting the role of artificial intelligence in solving the problem of flexible packaging waste, contributing to a cleaner and greener planet, at the world’s largest business summit on flexible films and laminates for packaging and applications.

The flagship summit held between 30 September and 1 October 2024 at the Reliance Jio World Convention Centre in Mumbai, India, featured industry leaders, distinguished speakers, and delegates from over 25 countries. The event encompassed in-depth discussions and presentations on pressing topics including the evolving global packaging landscape, social responsibility, brand strategies in the FMCG sector, and recycling for circularity, amongst others.

In his keynote, Ashok Chaturvedi presented an insightful overview of the genesis and remarkable evolution of flexible packaging and the significant impact of AI on managing the problem of flexible plastic waste. He said, “With a global population of 8 billion, we cannot ignore our reliance on flexible packaging, essential for delivering food, pharmaceutical, and other consumer products while ensuring safety, durability, protection from contamination, safer transportation, and enhanced accessibility”.

“The need of the hour is to deploy advanced AI sorting technologies that will use sensors to separate food-grade from non-food-grade plastics. UFlex is making significant investments in these technologies, and we will be ready to showcase our MVP in the coming months. These advanced technologies will be integrated into our global recycling infrastructure, which spans India, Poland, and Mexico. We are the only company that is working within India and globally on innovative solutions in flexible MLP materials and PCR and its applications,” he added.

“By leveraging these AI technologies, we can enhance our recycling processes and contribute to a more sustainable future. The future of packaging lies in our ability to innovate sustainably and responsibly. We invite regulators, policymakers, brand owners, and other producers to witness this technology at our facilities in early 2025. We will be happy to collaborate with the industry to scale this and deliver on our Government’s EPR and sustainability goals,” he concluded.

At the event, Jeevaraj G Pillai, director – sustainability and president – flexible packaging and new product development, UFlex, moderated an important panel discussion: Drivers, Challenges, and Barriers to Recycling: Is India Ready?

Pillai shared insights into UFlex’s sustainability initiatives, stating, “Our commitment to sustainability is not just about compliance; it is about innovating solutions that make a real impact on the environment and propel a circular economy. We promote environmentally friendly processes, evaluate the effect of raw materials on the environment, and opt for lower-emission sourcing choices in flexible packaging. We are aligning our ESG targets with efforts to mitigate global warming and have initiated a strategy for carbon offsetting through community-based and biodiversity projects.”

The summit also features specialized sessions focused on sustainability, including panel discussions that address the critical role of flexible packaging in green energy, as well as emerging film extrusion technologies and new developments. Distinguished speakers from the Ministry of Environment, Forest and Climate Change (MoEFCC), the Ministry of Chemicals and Fertilizers (MoCF), and the Department of Chemicals and Petrochemicals, will engage in discussions on aligning product development with circularity needs.

NewsDesk
NewsDesk
The editorial team of The Packman who handle all the press releases with Sunil Jain working as the desk editor.

LEAVE A REPLY

Please enter your comment!
Please enter your name here

This site uses Akismet to reduce spam. Learn how your comment data is processed.

Latest news

hubergroup launches low-tack versions of NewV UV offset inks

hubergroup Print Solutions has expanded its UV offset portfolio with the introduction of low-tack versions of its UV offset...

Lavazza launches capsule-free Tablì tabs in North America

Lavazza North America has introduced Tablì to the US market following the product’s earlier launch in Italy. The 100%...

ProPak India 2026 to accelerate sustainable packaging and smart manufacturing transformation

The 8th edition of ProPak India, a B2B platform for packaging, processing, and supply chain innovation, is scheduled to...

PPRDC launches ‘Plastics Recycling’ – a comprehensive guide to circular economy and sustainable packaging

The Packaging and Printing Research and Development Centre (PPRDC) has announced the launch of ‘Plastics Recycling’, a comprehensive book...
- Advertisement -spot_img

Holostik wins three awards at FIPSA 2026 Responsible Packaging Awards

Holostik Group has secured three awards at the FIPSA 2026 Responsible Packaging Awards, in the Commercial Innovation category. Out...

Asahi Photoproducts receives EcoVadis Silver

Asahi Photoproducts' flexographic plate manufacturing site in Japan has been awarded an EcoVadis Silver Medal following the company's first...

Must read

Syntegon’s in-house show in Verna, India

From 1 to 3 November 2023, Syntegon will welcome...

Xeikon Café Packaging Innovations 2017

An integral part of the Xeikon Café Packaging Innovations...

You might also likeRELATED
Recommended to you