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Syntegon Publishes 2025 Sustainability Report

Syntegon, a strategic lifecycle partner to the pharmaceutical, biotech, and food industries, has published its 2025 Sustainability Report, highlighting significant and measurable progress across...

Koenig & Bauer unveils CutPRO 2.1 flatbed die-cutter for corrugated board

Koenig & Bauer has introduced the CutPRO 2.1, a new flatbed die-cutter for corrugated board processing. Developed jointly within the Group, the machine is...

Romaco India showcases blister packaging and tableting expertise at Hyderabad open house

Romaco India, the Sales & Service Centre of the Romaco Group, hosted a three-day open house at its Experience Centre in Hyderabad from 9...

Epson to showcase on-demand color labeling and thermal printing solutions at Foodpro 2026

Epson will demonstrate its on-demand color labeling and thermal receipt printing solutions at Foodpro 2026, a food and beverage manufacturing trade event in Australia....

Herma launches Linerless Plus label material with 62Dps adhesive

Herma has introduced Linerless Plus (400), a linerless label material using the multi-layer pressure-sensitive adhesive 62Dps for the first time in this product range,...

Koenig & Bauer and Siemens collaborate on next-generation software-defined machine architecture

The strategic partnership between Koenig & Bauer and Siemens, initiated one year ago, is progressing according to plan along the defined multi-year roadmap. In...

HIPLEX 2026 Roadshow held in Hyderabad

The roadshow for HIPLEX 2026, India’s third-largest plastics exhibition, was held on Saturday night at ITC Kakatiya, Hyderabad, setting the stage for one of...

UFlex secures patent for advanced reclosable packaging for large-format bags

UFlex, India’s largest multinational flexible packaging and solutions company, has secured an Indian patent, valid for a period of 20 years from the date...

Must Read

Tomra and Borealis open post-consumer plastic waste sorting and recycling plant

Tomra and Borealis has started the operation of their advanced mechanical recycling demo plant in Lahnstein, Germany, the result of a partnership that marries...

BST eltromat displays iPQ Center at Plastindia 2018

  At Plastindia 2018, BST eltromat’s main focus was the 100% defect detection platform – iPQ Centre. iPQ Centre is a combination of iPQ Check,...

swop to take place annually

From 2024, the Shanghai World of Packaging (swop) is set to become an annual event. As part of the interpack alliance, this trade fair...

Holostik wins three awards at FIPSA 2026 Responsible Packaging Awards

Holostik Group has secured three awards at the FIPSA 2026 Responsible Packaging Awards, in the Commercial Innovation category. Out of 280 entries received from...

Cosmo Films beats its own best results once again

Cosmo Films, a global leader in films for packaging, labeling, lamination and synthetic paper and an emerging player in specialty chemicals and polymers, has...