Tuesday, December 9, 2025
EventsDoro Packaging at Paris Packaging Week 2025

Doro Packaging at Paris Packaging Week 2025

-

Doro Packaging at Paris Packaging Week 2025

-

At the upcoming Paris Packaging Week – PCD, taking place from 28 to 29 January 2025, Doro Packaging (Stand W176) will unveil a groundbreaking innovation in sustainable packaging: a 100% cardboard insert solution developed for Sisley’s 2024 holiday gift boxes. Sisley, a loyal client of Doro Packaging for over 30 years, is once again at the forefront of eco-friendly luxury.

As part of its ambitious CSR strategy, Sisley partnered with Doro Packaging to design an eco-friendly and aesthetically pleasing alternative to plastic inserts. This 100% cardboard solution meets stringent requirements:

  • Reduced environmental impact: The solution boasts a carbon footprint 2.6 times lower than RPET inserts.
  • Refined design: Ensures no visible gaps, even after the products are removed.
  • Reliable product support: Rigorously tested and validated under transport conditions.

“The aesthetic and quality aspects were decisive in awarding this project to Doro Packaging,” shared Anaïs Pradal and Elise Picot, purchasing and development managers involved in the project.

Doro Packaging worked closely with Sisley to design an innovative, scalable cardboard insert. Made up of three components – perforated grid, compartments, and a finishing cover – the solution was meticulously developed to meet Sisley’s technical and aesthetic needs.

“This project is a perfect example of our ability to innovate through collaboration. Our goal was to deliver a unique solution that combines design, sustainability, and reliability. The success of this project with Sisley is a source of great pride for our teams,” said Gilles Regnard, sales manager at Doro Packaging.

NewsDesk
NewsDesk
The editorial team of The Packman who handle all the press releases with Sunil Jain working as the desk editor.

LEAVE A REPLY

Please enter your comment!
Please enter your name here

This site uses Akismet to reduce spam. Learn how your comment data is processed.

Latest news

US Industry Survey – material shortages top concern for future packaging

Packaging professionals in the US view shortages of packaging products and materials as the key challenge likely to be...

Flint Group confirms compositional GIO compliance across its packaging inks and coatings portfolio

Flint Group, a global leader in inks, coatings, and service solutions for the packaging industry, has confirmed its compliance...

PACK IT installs SASG UV solutions

PACK IT, a leading name in the packaging and box production sector, has installed modern UV solutions from SASG....

Konica Minolta named leader in IDC Label Printer Report

Konica Minolta Business Solutions USA (Konica Minolta) has been named a Leader in the IDC MarketScape: Worldwide High-Speed Digital...
- Advertisement -spot_img

Bobst announces flexible packaging open house at Atlanta Competence Center

Bobst will host a one-time open house for the flexible packaging supply chain at its Atlanta Competence Center in...

Xeikon launches Ecolyne press at Labelexpo Asia 2025

Xeikon has entered the Asia-Pacific label market with a new digital press offered through Ecolyne, a subscription-based capacity service....

Must read

Domino sees record growth in high-speed variable data printing onto labels

With the ongoing trend to track more products through...

Monotech launches multiple products at Labelexpo India

Monotech Systems, India’s leading provider of products and solutions...

You might also likeRELATED
Recommended to you