Thursday, July 23, 2026
EventsKodak at PrintPack 2019 – Hall 5 Stand C15

Kodak at PrintPack 2019 – Hall 5 Stand C15

-

Kodak at PrintPack 2019 – Hall 5 Stand C15

-

At PrintPack 2019 Kodak will showcase its complete range of printing solutions. In the offset segment, the company will showcase its CtP portfolio and printing plates with special focus on its process free plate SONORA.

In Flexography prepress, Kodak will present the well established Kodak Flexcel NX solution. “Kodak’s Flexcel NX solution has benefited our customers all over the world by elevating the standard of flexographic printing. Workflow is the heart of prepress and we will expand our conversation on Kodak Prinergy Cloud and the benefits that can be unlocked with investments in the latest in workflow solutions. We will also highlight the strength of our electro-photographic digital printing technologies with the Kodak NexPress platform, which delivers excellent image reproduction and drives productivity. Kodak Prosper Inkjet Imprinting technology is revolutionizing high-speed inkjet printing and we look to showcase this as well,” said Hersh Lulla of Kodak.

Lulla added, “Across all solutions, we will display real samples and real benefits that our customers have experienced by choosing Kodak solutions. We will have live demos of Prinergy Cloud and our workflow solutions too. With a diverse set of solutions, Kodak can help print business owners diversify their business and grow in today’s competitive business environment.”

Manash Das
Manash Das
Manash Das is associate editor at The Packman. He has been contributing editorially to The Packman since 2016.

LEAVE A REPLY

Please enter your comment!
Please enter your name here

This site uses Akismet to reduce spam. Learn how your comment data is processed.

Latest news

Romaco India showcases blister packaging and tableting expertise at Hyderabad open house

Romaco India, the Sales & Service Centre of the Romaco Group, hosted a three-day open house at its Experience...

Epson to showcase on-demand color labeling and thermal printing solutions at Foodpro 2026

Epson will demonstrate its on-demand color labeling and thermal receipt printing solutions at Foodpro 2026, a food and beverage...

Herma launches Linerless Plus label material with 62Dps adhesive

Herma has introduced Linerless Plus (400), a linerless label material using the multi-layer pressure-sensitive adhesive 62Dps for the first...

Koenig & Bauer and Siemens collaborate on next-generation software-defined machine architecture

The strategic partnership between Koenig & Bauer and Siemens, initiated one year ago, is progressing according to plan along...
- Advertisement -spot_img

HIPLEX 2026 Roadshow held in Hyderabad

The roadshow for HIPLEX 2026, India’s third-largest plastics exhibition, was held on Saturday night at ITC Kakatiya, Hyderabad, setting...

UFlex secures patent for advanced reclosable packaging for large-format bags

UFlex, India’s largest multinational flexible packaging and solutions company, has secured an Indian patent, valid for a period of...

Must read

Huhtamaki’s first India edition of Think Circle

Huhtamaki India organized the first India edition of its...

Miraclon Channel Partner Awards Program recognizes best-performing companies in 2022

Miraclon recognized its top channel partners for their sales,...

You might also likeRELATED
Recommended to you