Sunday, November 16, 2025
Industry NewsIPAMA and NASSCOM ink MOU for technology upgradation

IPAMA and NASSCOM ink MOU for technology upgradation

-

IPAMA and NASSCOM ink MOU for technology upgradation

-
IPAMA and NASSCOM ink MOU
Sudhanshu Mittal of NASSCOM Center of Excellence and Prashant Vats of IPAMA

An MOU was signed between Iqbal Singh, general secretary, Indian Printing Packaging & Allied Machinery Manufacturers (IPAMA); and Sudhanshu Mittal, head – Gurugram Center & Director – Technical Solutions, National Association of Software and Service Companies (NASSCOM) Center of Excellence – IOT & AI at Noida on 20 July 2020.

NASSCOM Center of Excellence – IoT & AI is part of the Digital India Initiative by Ministry of Electronics & IT (MeitY), in partnership with the State Governments and NASSCOM.

It is a nationwide program to develop culture of thought leadership, digital transformation and co-creation in Industry 4.0, automotive, healthcare, agriculture, energy, and other industry verticals. CoE is also engaged in facilitating technology adoption by the industry, by bringing the latest and innovations for start-ups and technology companies, and to help grow and scale their business interests. It also provides largest Innovation platform for enterprises, governments and innovators in emerging technologies of AI, ML, IoT, big data, analytics, AR/VR and robotics for digital Transformation. NASSCOM aims to be the primary catalyst for development and adoption of innovative digital solutions in different domains.

On the eve of signing of the agreement, Dayaker Reddy, president, IPAMA said, “This agreement will strengthen the Indian printing and packaging machine manufacturers in upgrading their machines. In India, the emerging technologies such as artificial intelligence and advance printing and packaging are user-friendly for end-customers and ensuring widespread use in different sectors of the industry. The situation will change more in the coming years and more and more companies will come forward to make investments in automation of machines for quality enhancement, increase the production, make economical etc. We are encouraging the companies for adoption of new technologies in the printing and packaging sector.”

Sudhanshu Mittal stated that we are committed to helping Indian manufacturing sector with digital technology adoption to improve their quality, productivity, worker safety and any other area where they need help. Indian ecosystem has variety of solutions available to meet the requirements of manufacturing companies.

Through this partnership, we expect that IPAMA members will be able to leverage the expertise offered to adopt the digital technology in their operations and start their Industry 4.0 journey.

The objective of the MOU is to impart training to IPAMA Members in the emerging areas of IT-based technology and to help them with digital technology adopt in their operations. The scope of work incorporated in the agreement reads as under:

  • Enable access for the members of IPAMA to the latest innovative products and solutions from the startups incubated by NASSCOM CoE and from the extended startup ecosystem.
  • A deep-dive engagement program of NASSCOM CoE to fast track discovery and application of innovative solutions sourced from its network of deep-tech curated startups /innovators, system integrator and technology companies.
  • To organize joint events and workshops to build awareness about the implementation of technology in printing and packaging machine manufacturing segments.
  • To make members aware of existing and new use-cases as they get created to drive adoption of deep-tech within the industry ecosystem.
NewsDesk
NewsDesk
The editorial team of The Packman who handle all the press releases with Sunil Jain working as the desk editor.

LEAVE A REPLY

Please enter your comment!
Please enter your name here

This site uses Akismet to reduce spam. Learn how your comment data is processed.

Latest news

Archroma wins EcoVadis Gold for the second year

Archroma, a global leader in specialty chemicals towards sustainable solutions, has been awarded a Gold rating by EcoVadis for...

Ball scales up in India with new production expansion

Ball Corporation, a global leader in sustainable aluminum packaging, announces strategic investments in India, reinforcing its long-term commitment to...

AWA acquires AIPIA

AWA Alexander Watson Associates (AWA), a leading global market intelligence and market insights firm specializing in the packaging, converting,...

UFlex partners with TCK for Tech Mahindra Global Chess League 2025

UFlex, India’s largest multinational flexible packaging and solutions company, has announced its sponsorship of Triveni Continental Kings (TCK) for...
- Advertisement -spot_img

MPS declares bankruptcy

Label and flexible packaging press manufacturer MPS has announced that several of its Dutch entities have filed for provisional...

Bobst introduces Expert K5 metallizer with autonomous drive

The new automated Bobst Expert K5 is leading innovation in metallization for high-quality film production with integrated process Expertise...

Must read

Multi-dimensional approach to fighting food losses and waste at interpack

For its 3rd edition the SAVE FOOD Congress held...

NGA Plastic Technology India at the K 2025

“We are very happy to celebrate not one, but...

You might also likeRELATED
Recommended to you