Saturday, March 14, 2026
Industry NewsiC3D releases v4.1 for ultimate luxury look in real-time

iC3D releases v4.1 for ultimate luxury look in real-time

-

iC3D releases v4.1 for ultimate luxury look in real-time

-

Creative Edge Software, developer of the award-winning iC3D packaging design software, announces the release of its latest version of the all-in-one, multi-function application. Among a range of updates designed to augment photorealistic capabilities already available from iC3D, the new version 4.1 includes Creative Edge Software’s latest technological advance, Bump Displacement, which expands the potential for designers to create unique 3D shapes and surfaces providing a greater sense of depth, detail and photographic accuracy.

With iC3D v4.1, Bump Displacement – also known as Displacement Mapping – enables packaging creatives to quickly create and visualize emboss or deboss design features to a photorealistic standard in a matter of minutes. The development is of particular relevance to the luxury and security packaging sectors where unique and complex shapes in glass, plastic and carton are used to distinguish premium products and ensure that they are more difficult to copy.

Previously, to achieve photorealistic mockups or proofs of emboss/deboss design devices required the use of high-end specialist, proprietary software applications. iC3D’s Bump Displacement means that designers can achieve the same visual effect with a simple Illustrator file using the same all-in-one iC3D software that performs every other packaging design visualization application, including labels, pouches, shrink-wraps and shelf visualization.

According to Nick Gilmore, CEO of Creative Edge Software, the beauty of the iC3D Bump Displacement feature is its simplicity and speed. “Luxury brands use selective embossing and debossing to convey a higher pedigree for their products. It’s the very complexity of producing the packaging that distinguishes it from regular high-street brands,” he explains. “Nevertheless, through meticulous research and development, our software designers have delivered the programming that can visualize these complex techniques, realistically and in real-time.”

The Bump Displacement feature of iC3D v4.1 allows the user to take a line drawing, logo or any shape created in Adobe Illustrator, and apply it to the surface of a carton, glass, plastic, or metal object, but working in real time. Simple sliders are then used to choose the depth of emboss or deboss. Once satisfied with positioning, size and style of emboss/deboss, iC3D Ray Tracing can be applied to accurately simulate the effects of light on the object and produce a photorealistic, ultra-high-resolution photo studio effect. As with all iC3D mockups, the 3D results can then be scrutinized from all angles by brand owners, production engineers and other stakeholders using iC3D Opsis via any web browser on any smartphone, tablet or computer.

Two tutorials demonstrating this simplicity in practice are available on the new updated Creative Edge Software website. Entitled Bump Displacement Parts 1 and 2, they can be viewed via the link:
http://www.creativeedgesoftware.com/category/tutorial/.

“We feel very satisfied with the latest developments in iC3D v4.1,” confirms Gilmore. “In iC3D, we pride ourselves on having the most versatile – and affordable – packaging design application on the market, and this is yet another step towards making the best capabilities available to all. After all, just because creatives are working on luxury brands, that doesn’t mean they can afford luxury price tags on the everyday tools they need!”

Mahan Hazarika
Mahan Hazarika
Mahan Hazarika assumes the role of Editor at The Packman, a position he has held since 2017, reflecting a distinguished decade-long tenure specializing in journalism within the printing and packaging sectors. Beyond his professional realm, he nurtures a deep appreciation for music, travel, and films, finding inspiration and relaxation in these pursuits.

LEAVE A REPLY

Please enter your comment!
Please enter your name here

This site uses Akismet to reduce spam. Learn how your comment data is processed.

Latest news

Industry and government leaders explore future of packaging at 6th IIP International Summit

Industry leaders, technology experts, policymakers, and sustainability advocates recently came together at the 6th International Summit for the Packaging...

Lecta introduces no PFAS added papers

Lecta has introduced a comprehensive portfolio with no PFAS added that enables converters and brand owners to transition to...

Flint Group earns RecyClass approval for its NC-free inks

Flint Group, a leading supplier of inks and coatings for the global packaging sector, has achieved RecyClass technology approval...

Sitma introduces automated bagging system

Sitma has introduced PackHub, a compact automated bagging system designed to simplify and accelerate order fulfillment operations. As e-commerce...
- Advertisement -spot_img

ABG to debut at interpack 2026

Leading finishing equipment manufacturer, AB Graphic International (ABG), will make its debut appearance at interpack 2026, in Düsseldorf on...

Miraclon launches Flexcel Prime Plate

On 12 March 2026, Miraclon announced the global launch of the Flexcel Prime Plate, its most advanced plate technology...

Must read

Labelexpo Europe 2019 – Gallus focuses on digitization of label production

Gallus, a subsidiary of Heidelberger Druckmaschinen AG, will focus...

BillerudKorsnäs and Aisa pioneer new horizons in paper tube packaging

In the ongoing work to challenge conventional packaging, BillerudKorsnäs...

You might also likeRELATED
Recommended to you