Wednesday, May 13, 2026
AwardsAsahi Kasei receives 2025 TSMC Excellent Performance Award

Asahi Kasei receives 2025 TSMC Excellent Performance Award

-

Asahi Kasei receives 2025 TSMC Excellent Performance Award

-

Asahi Kasei received a 2025 TSMC Excellent Performance Award for “Excellent technology development and production support” in advanced packaging materials at the 2025 Supply Chain Management Forum held by Taiwan Semiconductor Manufacturing Co. on 25 November 2025.

The award recognizes suppliers for their outstanding performance in the development of innovative technologies and production support for advanced packaging materials during the past year.

Nobuko Uetake, senior executive officer of Asahi Kasei and key leader in the company’s electronics materials business, commented, “Our electronics business, including PIMEL is positioned as first priority in Asahi Kasei’s ‘Trailblaze Together’ medium-term management plan for fiscal 2025–2027. We have developed PIMEL products that meet diverse customer requirements by leveraging years of advanced technological expertise, and are making proactive investments to ensure stable supply, including the launch of a new plant. We look forward to continuing to support the rapidly evolving field of advanced semiconductors, especially for AI-related applications.

NewsDesk
NewsDesk
The editorial team of The Packman who handle all the press releases with Sunil Jain working as the desk editor.

LEAVE A REPLY

Please enter your comment!
Please enter your name here

This site uses Akismet to reduce spam. Learn how your comment data is processed.

Latest news

Provident launches eco-friendly end seal with 30% recycled rubber

Provident has introduced a new eco-friendly end seal that is made with 30% recycled rubber and is designed to...

Lecta unveils paper cups with EraCup Natural Pure

Lecta has launched EraCup Natural Pure, an innovative solid bleached board (SBB) designed for more sustainable, high-performance packaging. Developed...

UPM, Michelman and Bobst introduce bio-based paper packaging

UPM Specialty Materials, Michelman, and Bobst have joined forces to develop two validated paper-based packaging concepts for brands navigating...

Henkel upgrades Packaging Competence Center

Henkel Adhesive Technologies has inaugurated a modernized packaging competence center in Düsseldorf. The center is equipped with new, cutting-edge...
- Advertisement -spot_img

Schreiner Group celebrates tenth anniversary of Chinese location

German-based Schreiner Group has marked ten years of operations at its production facility in China, located in the Greater...

Carlsberg rolls out rounded-corner multipack in collaboration with DS Smith and KHS

Carlsberg has introduced a new cardboard multipack featuring rounded corners – the DS Smith Round Wrap – across supermarkets...

Must read

BST India launches three products at Plastindia 2023

BST India launched three products at Plastindia 2023 –...

GEW founder Malcolm Rae wins Global Achievement Award

Malcolm Rae has been announced the winner of this...

You might also likeRELATED
Recommended to you