Sunday, November 15, 2026
LabelsVinsak to exhibit and lead panel discussions at Flexo...

Vinsak to exhibit and lead panel discussions at Flexo Summit Asia 2026

-

Vinsak to exhibit and lead panel discussions at Flexo Summit Asia 2026

-
Modular machine for converting and label embellishment

Vinsak Group will participate in Flexo Summit Asia, taking place in Bengaluru on 5-6 August 2026, an event bringing together leaders, innovators, and decision-makers from across the printing and packaging value chain to discuss the evolving landscape of flexographic and related print technologies.

Vinsak will host a stand at the summit, showcasing its portfolio of hybrid short-to-medium run printing and packaging solutions for flexibles, shrink sleeves, in-mold labels (IML), folding cartons, pharma labels, and other applications. Visitors to the stand will also see the company’s brand protection and connected packaging solutions, along with its label finishing and inkjet solutions, which the company said reflect its evolution from technology reseller to manufacturer.

- Advertisement -

Alongside its exhibit presence, Vinsak will take part in shaping industry dialogue at the summit, with two senior leaders moderating panel discussions on consecutive days.

On 5 August, Ranesh Bajaj, founder and director of Vinsak Group, will moderate the FORD panel, a session exploring the convergence and future trajectory of flexo, offset, rotogravure, and digital print technologies. The discussion will bring together experts to examine how these technologies are evolving individually and intersecting to shape the next generation of print and packaging solutions.

On August 6, Gita Bajaj, director of business transformation, people and process at Vinsak Group, will moderate a session focused on next-generation packaging, addressing emerging trends, sustainability imperatives, innovation, and AI shaping the future of packaging across categories.

“Flexo Summit Asia is a valuable platform for the industry to compare notes on where print and packaging technology is genuinely headed,” said Mohd Rizwan, group marketing manager. “Our aim in moderating these sessions is less about presenting answers and more about surfacing the right questions around technology convergence, sustainability, and what the next generation of packaging will demand of manufacturers.”

Vinsak’s participation reflects its continued commitment to fostering open industry dialogue, drawing on its experience across narrow web printing, label finishing, and cross-technology print solutions for customers in over 130 countries.

NewsDesk
NewsDesk
The editorial team of The Packman who handle all the press releases with Sunil Jain working as the desk editor.

LEAVE A REPLY

Please enter your comment!
Please enter your name here

This site uses Akismet to reduce spam. Learn how your comment data is processed.

Latest news

PACK.Nxt 2026 to be held in Mumbai on 15 December

The fourth edition of PACK.Nxt, a forum for packaging leaders in India, will be held on 15 December 2026...

Sidel Japan to showcase liquid packaging line solutions at Drink Japan 2026

Sidel Japan will present its technologies and specialist team at Drink Japan 2026, held 18 to 20 November at...

Embee Flexi Label builds on HP Indigo success with second press

For Bengaluru-based Embee Flexi Label, the move from conventional offset printing to digital label production was a significant business...

Henkel launches heat-seal coating for paper eCommerce packaging

Henkel Adhesive Technologies has launched Aquence HS 2819 RE, a recycling-compatible, water-based heat-seal coating designed to provide a reliable...
- Advertisement -spot_img

Taarget Papers looks to connect global paper innovation with Indian packaging needs

Pratik Nikhil Gandhi, director of Taarget Papers LLP and Enkey Enterprise, discusses the evolution of the family’s paper business,...

Siegwerk focuses on next-generation ink and coating solutions for evolving label applications

At LOUPE India 2026, Siegwerk showcased a range of ink and coating solutions addressing the changing requirements of the...

Must read

Heidelberg takes on cost pressures, skills shortage and sustainability at drupa 2024

The printing sector is facing a combination of three...

Get label smart at FINAT’s Technical Seminar

  The age of smart products is happening now. That...

You might also likeRELATED
Recommended to you