Thursday, July 23, 2026
Industry NewsXSYS to showcase advanced flexo plate technology at Labelexpo...

XSYS to showcase advanced flexo plate technology at Labelexpo India 2024

Hall 10, Stand F38

-

XSYS to showcase advanced flexo plate technology at Labelexpo India 2024

Hall 10, Stand F38

-

XSYS, a leading global supplier of prepress and printing solutions, has confirmed its participation in Labelexpo India 2024, where it will unveil its latest advancements in printing plate technology for the tag and label industry.

Scheduled from 14 to 17 November, Labelexpo India 2024 will gather leaders from the label industry at the India Expo Centre & Mart in Greater Noida, Delhi NCR. This year’s showcase promises to highlight innovations aimed at driving efficiency and quality in label production, with XSYS poised to play a central role in presenting transformative solutions for the sector. Joining Labelexpo India for the first time under the XSYS banner, the company will be exhibiting on Stand F38 in Hall 10.

“The label market in India is expected to grow at twice the rate of the global average, so there’s a lot of potential for flexo label printers. Our mission is to support them in taking full advantage of this great opportunity with our industry-leading prepress solutions along with our robust service offering. Naturally, this means engaging directly with the market at key events such as Labelexpo India,” said Roy Schoettle, VP XSYS APAC.

The nyloflex portfolio of flexographic printing plates for labels will be a highlight at the show. The nyloflex range is continually improved with new plate formulations designed to meet the ever-changing needs of the market, such as new types of eco substrates, higher printing speeds and expanded application reach.

One example is the versatile nyloflex FTV flat-top dot plate which can be used for printing not only tag and labels but also flexible packaging. Offering exceptional and consistent print quality with the finest highlight dots, the nyloflex FTV plate reduces complexity at the prepress stage, because it is suitable for both bank and LED exposure. Furthermore, this formulation is less prone to plate swelling and features AIF (anti-ink filling) technology enabling longer and cleaner print runs with solvent-based inks.

“We’re looking forward to discussing our celebrated nyloflex flexo plates and the wider XSYS portfolio, including ThermoFlexX plate imagers, Catena plate processing equipment, nyloflex Xpress thermal plate Processor, and rotec sleeves and adapters with visitors at Labelexpo India,” added Schoettle. “As a leader in the industry with a significant installed base across Asia, we understand the great benefits of meeting face-to-face in an environment that is conducive to deep learning and beneficial knowledge sharing.”

NewsDesk
NewsDesk
The editorial team of The Packman who handle all the press releases with Sunil Jain working as the desk editor.

LEAVE A REPLY

Please enter your comment!
Please enter your name here

This site uses Akismet to reduce spam. Learn how your comment data is processed.

Latest news

Romaco India showcases blister packaging and tableting expertise at Hyderabad open house

Romaco India, the Sales & Service Centre of the Romaco Group, hosted a three-day open house at its Experience...

Epson to showcase on-demand color labeling and thermal printing solutions at Foodpro 2026

Epson will demonstrate its on-demand color labeling and thermal receipt printing solutions at Foodpro 2026, a food and beverage...

Herma launches Linerless Plus label material with 62Dps adhesive

Herma has introduced Linerless Plus (400), a linerless label material using the multi-layer pressure-sensitive adhesive 62Dps for the first...

Koenig & Bauer and Siemens collaborate on next-generation software-defined machine architecture

The strategic partnership between Koenig & Bauer and Siemens, initiated one year ago, is progressing according to plan along...
- Advertisement -spot_img

HIPLEX 2026 Roadshow held in Hyderabad

The roadshow for HIPLEX 2026, India’s third-largest plastics exhibition, was held on Saturday night at ITC Kakatiya, Hyderabad, setting...

UFlex secures patent for advanced reclosable packaging for large-format bags

UFlex, India’s largest multinational flexible packaging and solutions company, has secured an Indian patent, valid for a period of...

Must read

SRF acquires Kanpur Plastipack’s CPP film business

SRF, a leader in specialty chemicals and packaging films,...

Nilpeter to showcase FA-17 flexo press at Labelexpo Southeast Asia 2025

Labelexpo Southeast Asia 2025, taking place from 8 –...

You might also likeRELATED
Recommended to you