Flint Group Digital Xeikon has announced the return of Xeikon Innovation Days, taking place 9–10 June 2026 at its Global Innovation Center in Lier, Belgium, and one week later, on 16-18 June, at the Chicago Innovation Center in Elgin, Illinois. Under the umbrella theme ‘Print. Smarter. Together.’, the event will bring together customers, prospects and partners for an extensive programme of live demos, customer conversations, application showcases and hands-on experiences designed to accelerate decision-making in digital label and packaging production.
This year’s edition carries significance far beyond the event itself. Xeikon Innovation Days 2026 will also serve as a visible expression of a broader transformation: Xeikon’s evolution into Flint Group Digital Xeikon, a core digital business within the newly rebranded Flint Group Packaging Solutions.
The announcement follows Flint Group’s recent rebrand to Flint Group Packaging Solutions, reflecting the company’s focus on the global packaging sector and its commitment to delivering integrated, sustainable and future-ready solutions across inks, coatings, consumables, services and equipment. Within this renewed structure, Flint Group Digital Xeikon plays a critical role in helping packaging and label converters capture new opportunities through digital print technologies, digital consumables and connected solution ecosystems.
“Xeikon Innovation Days 2026 is more than an event announcement; it’s a statement of intent,” said Walter Benz, president Flint Group Digital Xeikon. “With Print. Smarter. Together’, we invite the market to experience how our business is evolving: more connected to packaging, more focused on customer outcomes, and more deeply integrated within Flint Group Packaging Solutions. We see this as a reboot in the best sense of the word, a renewed Xeikon with sharper focus, stronger backing and a broader solutions story.”
Attendees at the events will see how that vision translates into practical business value. The event programme will combine strategic content with operational relevance, featuring conference sessions, customer-centric discussions, partner contributions, and live demos of Xeikon’s digital press portfolio, including the brand-new Ecolyne and IDERA presses. Key topics will include AI in workflows and end-use applications, new growth paths for digital printing, customer-driven innovation, sustainability, and the practical role of connected solutions in modern label and packaging production.
An impressive list of industrial partners has signed up to exhibit during the events, including: Cerm, Esko, Fedrigoni, Flexowash, GM, Herma, Hybrid Software, Kurz, Lake Image Systems, Meech, Schober, Scribos, RBC, Wink, Yupo.
Pepyn Dinandt, CEO Flint Group Packaging Solutions, said, “We are seeing a market evolution across substrates, packaging formats and coatings to enhance recyclability while replacing complex structures. As a true platform supplier, we are committed to leading with innovation, sustainability and service, delivering solutions that meet the needs of packaging printers and brand owners today and in the future. Flint Group Packaging Solutions is well-positioned to lead the way. Flint Group Digital Xeikon is an important part of that future, bringing digital capability, application expertise and innovation power into our packaging solutions platform.”
For Flint Group Digital Xeikon, the June event aims to do two things: reaffirm its longstanding role as a digital technology innovator and introduce the market to its renewed role within a broader, packaging-focused organisation. Together, these messages signal that the company is entering a new phase – one defined by stronger alignment with packaging, greater ecosystem relevance, and a clearer value proposition for converters looking to grow with confidence.
With live technology at the heart of the experience, Xeikon Innovation Days 2026 is expected to attract a highly engaged audience, including existing customers and prospects actively evaluating their next investment. For attendees, the event will offer not only inspiration but also the chance to compare platforms, explore applications, meet solution partners and engage directly with the teams behind the technology.
