Thursday, November 12, 2026
EventsWorld Expo of Packaging Industry-Southeast Asia 2026 returns to...

World Expo of Packaging Industry-Southeast Asia 2026 returns to Jakarta in August 2026

-

World Expo of Packaging Industry-Southeast Asia 2026 returns to Jakarta in August 2026

-

The 2nd World Expo of Packaging Industry-Southeast Asia, organized by RX, will take place at the Jakarta International Expo (JIEXPO) in Indonesia from 27 to 29 August 2026. Centered on the World Expo of Packaging Industry-Southeast Asia, the event will be held alongside the Paper Chain Expo, Pack Plus, and Bakery ASEAN. Covering more than 22,000 square meters, the exhibition is intended to provide a trade platform spanning the packaging industry value chain, from raw materials and equipment manufacturing to packaging processing and end-use applications.

Indonesia, the largest economy in Southeast Asia, has emerged as an important manufacturing and investment destination in the region. According to the organizers, the growth of sectors such as e-commerce, food delivery, food and beverage, and pharmaceuticals has contributed to increasing demand for paper packaging, environmentally friendly packaging, and smart packaging solutions. Indonesia also serves a broader ASEAN market of more than 600 million people.

- Advertisement -

The organizers stated that World Expo of Packaging Industry-Southeast Asia 2026 will continue its focus on the Indonesian market and support industrial cooperation between China and ASEAN countries. The exhibition is being organized in collaboration with industry organizations, including the Asosiasi Kotak Karton Gelombang Indonesia (AKKGI), as well as packaging, papermaking, and printing associations from several countries. AKKGI is expected to organize participation from its member companies and will hold its 2026 annual convention and gala dinner during the exhibition. According to the organizers, the event will provide opportunities for interaction with approximately 500 industry representatives and buyers.

The 2026 edition will feature an exhibition area exceeding 22,000 square meters. Through collaboration with the Paper Chain Expo and Pack Plus, the exhibition will showcase paper raw materials and chemical agents, packaging and printing equipment, environmentally friendly materials, smart manufacturing solutions, and end-use applications.

The organizers stated that business matching activities will include targeted buyer invitations, one-on-one meetings, and the TAP (Targeted Attendee Program). These initiatives are intended to connect procurement decision-makers, brand owners, and distributors from across the region. The exhibition is expected to attract more than 25,000 buyers from Southeast Asia and other international markets.

The event will also include a series of industry forums and themed activities focused on topics such as sustainability and digitalization in the Southeast Asian packaging industry, green manufacturing and sustainable packaging, halal food packaging standardization and green supply chain collaboration, smart packaging and digital factories, packaging solutions for food delivery and ready-to-eat meals, innovative materials and molding technologies, and developments in the industrial application of pulp molding and food paper containers.

NewsDesk
NewsDesk
The editorial team of The Packman who handle all the press releases with Sunil Jain working as the desk editor.

LEAVE A REPLY

Please enter your comment!
Please enter your name here

This site uses Akismet to reduce spam. Learn how your comment data is processed.

Latest news

Sidel Japan to showcase liquid packaging line solutions at Drink Japan 2026

Sidel Japan will present its technologies and specialist team at Drink Japan 2026, held 18 to 20 November at...

Embee Flexi Label builds on HP Indigo success with second press

For Bengaluru-based Embee Flexi Label, the move from conventional offset printing to digital label production was a significant business...

Henkel launches heat-seal coating for paper eCommerce packaging

Henkel Adhesive Technologies has launched Aquence HS 2819 RE, a recycling-compatible, water-based heat-seal coating designed to provide a reliable...

Taarget Papers looks to connect global paper innovation with Indian packaging needs

Pratik Nikhil Gandhi, director of Taarget Papers LLP and Enkey Enterprise, discusses the evolution of the family’s paper business,...
- Advertisement -spot_img

Siegwerk focuses on next-generation ink and coating solutions for evolving label applications

At LOUPE India 2026, Siegwerk showcased a range of ink and coating solutions addressing the changing requirements of the...

Holostik wins five awards at LMAI Label Awards 2026

Holostik India, a provider of anti-counterfeiting, brand protection and security packaging solutions, has won five accolades across categories covering...

Must read

Vinsak showcases cutting-edge labelling and packaging solutions at Printpack 2025

At Printpack India 2025, held in Greater Noida from...

Markem-Imaje marks two decades of coding Amica Chips’ packaging lines

Markem-Imaje’s coding and marking equipment has been used across...

You might also likeRELATED
Recommended to you