Friday, May 1, 2026
Industry NewsVPF launches high-performance polyimide adhesive material

VPF launches high-performance polyimide adhesive material

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VPF launches high-performance polyimide adhesive material

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VPF has launched a polyimide adhesive material, a technically high-performance polyimide system that combines thermal and chemical resistance with very good printability. It is available from 200 square meters.

Polyimide is a high-performance polymer with exceptional temperature and chemical resistance, very high dimensional stability, and electrical insulation properties, and is used in demanding industrial applications. VPF said the latest product is specifically designed to address the challenges of modern production processes, such as printed circuit board marking, where thermal stresses and intensive cleaning are common.

Polyimide is ideal for extreme temperature ranges, with applications up to more than 300 °C and excellent long-term stability. The material shows above-average resistance to aggressive cleaning agents and soldering processes.

According to the company, the newly developed white, silk-matt surface ensures excellent contrast and high print quality for 1D/2D codes, serial numbers, and variable information, resulting in excellent readability and scannability.

With this new development, VPF said it is responding to growing demand from electronics manufacturing, mechatronics, and component marking, where materials are required that perform reliably even under the most demanding process conditions – without compromising print image or adhesion.

VPF claims that it now offers a solution with a top price-performance ratio, combined with a very low minimum purchase quantity of 200 m² and a working width of 1,000 mm. Narrow rolls are available on request in a width of 170 mm and 400 running meters, i.e., 68 square meters.

The polyimide base film is 50 microns thick and has a 20 micron white silk matt coating. The coating is stated to guarantee printability in thermal transfer printing. The VPF high-performance acrylate adhesive 801 adheres to printed circuit boards. A white standard glassine is used as the liner.

The material is temperature-stable up to 300 °C for short periods and is therefore ideally suited for common soldering processes in the printed circuit board industry.

The material is available immediately, and other thicknesses and colors are available on request.

NewsDesk
NewsDesk
The editorial team of The Packman who handle all the press releases with Sunil Jain working as the desk editor.

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