Sunday, February 22, 2026
EventsShanghai World of Packaging 2019 continues to grow

Shanghai World of Packaging 2019 continues to grow

-

Shanghai World of Packaging 2019 continues to grow

-

Shanghai World of Packaging (swop), hosted every two years by Messe Düsseldorf (Shanghai) and Adsale Exhibition Service, is developing rapidly. The upcoming edition will take place from 25 to 28 November at the Shanghai New International Expo Centre. The exhibition area is expanded by 20% compared with that of the previous edition, with five halls and a supporting programme. swop addresses the eight key target groups: foods, beverages, confectionery, baked goods, pharmaceuticals, cosmetics and daily care products, non-food and industrial goods. The trade fair thus offers an extensive trade platform for manufacturers of machines and materials in the packaging industry and the related processing industry. Registration for the trade fair is now open at www.swop-online.com/en.

SAVE FOOD and FMCG Future Zone

After the extremely successful premiere in China of SAVE FOOD during swop 2017, this segment in 2019 will once again focus extensively on solutions that contribute to curbing food waste and loss. A conference and a special presentation will take place in cooperation with The Food and Agriculture Organization of the United Nations (FAO) in Hall N2 and will illuminate approaches along the entire value chain, from the field to our plate.

The special ‘FMCG Future Zone’ was well received in 2017. In 2019, it will once again present trends about the most diverse materials, technologies and designs in the segments of food, cosmetics and pharmaceuticals, stretching across around 12,000 sq. meter. In cooperation with PKG Family, a leading organization in this field in China, the zone allows a direct connection with renowned companies in the aforementioned segments.

components – a meeting point for the supplier industry

In Hall N4, ‘components’ was inspired by the trade fair of the same name in Düsseldorf, which has taken place parallel to interpack since 2014. Exhibits from the fields of drive, control unit and sensor technology await visitors, along with software, machine components as well as complete automation systems and integrated automation solutions. This makes this exhibition attractive for companies that offer packaging and process technologies to customers in the eight key target groups from food to industrial goods.

Premiere of special topics

The special presentation on e-commerce logistics and packaging is a brand new addition to swop 2019. Here, smart automation solutions including robotics particularly take center stage. The special presentation on the complex issues surrounding packaging printing takes a closer look at trends in the fields of post press and converting, cardboard packaging, printing equipment, pre-press and digital printing as well as corrugated materials including paper, colors and consumables.

NewsDesk
NewsDesk
The editorial team of The Packman who handle all the press releases with Sunil Jain working as the desk editor.

LEAVE A REPLY

Please enter your comment!
Please enter your name here

This site uses Akismet to reduce spam. Learn how your comment data is processed.

Latest news

Mark Andy to host RFID smart-label workshop in Warsaw

Registration is now open for the RFID technology workshop at the Mark Andy demo center in Warsaw on 12...

Florian Schneeberger on building future-ready factories

As manufacturing shifts toward intelligence and flexibility, automation providers are being challenged to rethink long-held paradigms. In this exclusive...

Wausau launches black vellum laminate for wine and spirits labels

Wausau Coated Products has introduced a black vellum laminate label stock designed for premium branding applications. The material features...

Armis launches durable label company

Armis, a leading provider of durable label solutions for critical and extreme environments, has launched a durable label company....
- Advertisement -spot_img

Michelman launches primer for shrink sleeves

Michelman will introduce Dscoop Edge attendees to its newest primer under development in the DigiPrime Vision series, DigiPrime Vision...

Agra’s Darpan marks a decade of Komori with a brand new press

Nearly a decade ago, Agra-based Darpan Printers achieved a key milestone with the installation of its first brand new...

Must read

Cortec launches permanent ESD stretch film for static and corrosion protection

Cortec has introduced a new packaging product called EcoSonic...

Toppan and Amcor collaborate on NFC tag-enabled anti-counterfeiting solution for wine

Toppan Printing and Amcor have announced an agreement to...

You might also likeRELATED
Recommended to you