Monday, July 20, 2026
FlexiblesIndustry and government leaders explore future of packaging at...

Industry and government leaders explore future of packaging at 6th IIP International Summit

-

Industry and government leaders explore future of packaging at 6th IIP International Summit

-

Industry leaders, technology experts, policymakers, and sustainability advocates recently came together at the 6th International Summit for the Packaging Industry, organized by the Indian Institute of Packaging (IIP), to deliberate on the future of packaging under the theme ‘Packaging 5S–AI’. The event brought together stakeholders from across the packaging value chain to discuss innovation, sustainability, and the role of emerging technologies in shaping the next generation of packaging solutions.

In a keynote address at the summit, Jeevaraj Pillai, whole-time director, president – flexible packaging and new product development, and director – sustainability, UFlex, spoke about the evolving role of packaging in advancing sustainability and supporting a circular economy.

Highlighting the importance of innovation aligned with responsibility, Pillai emphasized that the future of packaging lies in designing materials and solutions that support circularity while continuing to meet the functional requirements of product protection, safety, and shelf life. He noted that packaging innovation must move beyond incremental improvements and focus on developing structures that are compatible with existing recycling systems.

Reinforcing the industry’s progress in this direction, Pillai said, “Whatever is extrudable is recyclable,” underlining that materials capable of being reprocessed through extrusion can be recycled back into films and other products. He explained that this principle is central to advancing true circularity in flexible packaging, where materials are designed not only for performance but also for recyclability.

Pillai also highlighted the need for stronger collaboration across the packaging ecosystem – from material producers and converters to brand owners and policymakers – to accelerate the transition towards sustainable packaging solutions that reduce waste while supporting efficient resource use.

The summit, themed ‘Packaging 5S–AI’, focused on advancing packaging that is Safe, Secure, Standardized, Smart, and Sustainable, while exploring the role of emerging technologies such as Artificial Intelligence (AI) in addressing evolving sustainability and regulatory expectations within the industry.

NewsDesk
NewsDesk
The editorial team of The Packman who handle all the press releases with Sunil Jain working as the desk editor.

LEAVE A REPLY

Please enter your comment!
Please enter your name here

This site uses Akismet to reduce spam. Learn how your comment data is processed.

Latest news

HIPLEX 2026 Roadshow held in Hyderabad

The roadshow for HIPLEX 2026, India’s third-largest plastics exhibition, was held on Saturday night at ITC Kakatiya, Hyderabad, setting...

UFlex secures patent for advanced reclosable packaging for large-format bags

UFlex, India’s largest multinational flexible packaging and solutions company, has secured an Indian patent, valid for a period of...

FSSAI pulls up alcohol makers over misleading ‘aged’ claims, flavour violations

The Food Safety and Standards Authority of India (FSSAI) has issued notices to alcoholic beverage manufacturers over alleged violations...

Brilliant Polymers reinforces solvent-free leadership at ElitePlus 2026

At the 13th Speciality Films & Flexible Packaging Global Summit & Exhibition (ElitePlus 2026), Brilliant Polymers will showcase its...
- Advertisement -spot_img

Konica Minolta showcases production print portfolio at Print Expo Chennai 2026

Konica Minolta Business Solutions India showcased its portfolio of production print technologies and intelligent workflow solutions at Print Expo...

Canpac acquires Krishna Creation, plans new Ahmedabad plant

Canpac has acquired Krishna Creation, an Ahmedabad-based folding carton and rigid box packaging manufacturer, expanding its presence in India’s...

Must read

Laser scoring – value addition for flexible packaging

Since 1982 SEI Laser, a world-leading Italian company, designs...

GEW to launch LeoLED at Labelexpo 2019

GEW will launch its latest innovation, the LeoLED UV...

You might also likeRELATED
Recommended to you