Thursday, October 23, 2025
Packaging PrepressRenuka to show corrugation ERP solutions at IndiaCorr Expo...

Renuka to show corrugation ERP solutions at IndiaCorr Expo 2025

-

Renuka to show corrugation ERP solutions at IndiaCorr Expo 2025

-

Renuka Softtec, a leading developer and provider of AI-enabled customisable ERP solutions for the printing and packaging industry, is presenting upgraded solutions for the corrugation companies at IndiaCorr Expo 2025. IndiaCorr Expo 2025 is scheduled to take place from 11–13 September 2025 at India Expo Mart in Greater Noida, Delhi-NCR.

“What we have set to showcase at IndiaCorr Expo 2025 are some of our full-fledged customizable ERP solutions designed specifically for corrugation jobs with integrated advanced AI technology for speed and accuracy. These ERP solutions are seamlessly developed for master cartons and such products in the corrugation domain,” says Manish Madhusudan, co-founder of Renuka Softtec. He adds that every workflow solution of Renuka Softtec is customizable.

Madhusudan further mentions that Renuka’s ERP solutions to be presented at IndiaCorr Expo 2025 are customized in accordance with the specific needs and requirements of the corrugation industry. “Generalization cannot work everywhere or fit into anywhere. This is what makes us design the ERP solutions fully customizable for the corrugation companies and we are exclusively presenting them at the show,” he adds.

Renuka Softtec is at Stall C-45 in Hall-10 at IndiaCorr Expo 2025

NewsDesk
NewsDesk
The editorial team of The Packman who handle all the press releases with Sunil Jain working as the desk editor.

LEAVE A REPLY

Please enter your comment!
Please enter your name here

This site uses Akismet to reduce spam. Learn how your comment data is processed.

Latest news

Heidelberg India signs MOU with Sri Kaliswari Group to launch MK Masterwork Demo and Training Center

On 15 October 2025, a Memorandum of Understanding was signed between Thomas Frank, managing director, Heidelberg Asia Pacific, and...

Asahi Photoproducts to host second AWP Environment Event at CIIE 2025 in Shanghai

Asahi Photoproducts, a leader in sustainable flexographic plate technology and a division of Asahi Kasei, will exhibit at the...

New president, vice-president, board members and re-elections at GRA

The Global Rotogravure Association (GRA) is pleased to announce the election of new officers and board members during its...

Amcor announces operational launch of new MDO line in Peru

Amcor, a global leader in developing and producing responsible packaging solutions, announced the installation and operational readiness of a...
- Advertisement -spot_img

Ranpak brings AI-driven packaging intelligence to Logistica Next 2025

Ranpak, a global leader of sustainable paper-based automated packaging solutions for e-commerce and industrial supply chains, will exhibit its...

London Packaging Week 2025 sees strong rise in visitors

London Packaging Week 2025 has recorded a 15% growth in attendance, attracting 5,752 unique visitors to Excel London. Now...

Must read

Sustainability – a buzzword lost in practice?

In recent years, the word ‘sustainability’ has taken center...

Heidelberg celebrates 175 years of innovation and excellence

On 11 March 1850 – exactly 175 years ago...

You might also likeRELATED
Recommended to you