Wednesday, October 21, 2026
LabelsKurz India to showcase surface embellishment technologies at LOUPE...

Kurz India to showcase surface embellishment technologies at LOUPE India 2026

-

Kurz India to showcase surface embellishment technologies at LOUPE India 2026

-

Kurz India will showcase ‘Future of Surface Embellishment’ at LOUPE India 2026, being held from 28 October to 1 November at India Expo Mart, Greater Noida. Visitors can meet the Kurz India team at Stand K-22, where the company will present technologies and innovations from around the world, with a focus on labels, digital embellishment, premium decoration, security and sustainable surface solutions.

Key highlights include the 360° demo tool for digital embellishment, Distorun, Silver Line, Kurz Dreamcomposer and Trustseal SFX, supported by application samples and technology information. The stand will also cover Kurz’s sustainability initiatives and its approach to combining creativity, technology, resource efficiency and surface decoration.

Kurz sales and application experts will be present throughout the exhibition, with catalogs and physical samples, to discuss customer-specific requirements and explore suitable application opportunities.

Kurz India said it aims to show how design, material selection, digitalization, embellishment technology and production processes can work together to turn creative concepts into commercially viable labels and packaging.

NewsDesk
NewsDesk
The editorial team of The Packman who handle all the press releases with Sunil Jain working as the desk editor.

LEAVE A REPLY

Please enter your comment!
Please enter your name here

This site uses Akismet to reduce spam. Learn how your comment data is processed.

Latest news

W&H launches Oneflex modular CI flexo press for flexible packaging

Windmöller & Hölscher (W&H) has launched Oneflex, a new modular CI flexographic printing press for flexible packaging production, which...

UPM, Uteco and Siegwerk introduce a paper-based solution for secondary packaging

UPM Specialty Materials, Siegwerk and Uteco have developed a paper-based solution for secondary packaging. UPM provides the barrier base...

FineLine Technologies showcases RFID and barcode labeling at Pack Expo 2026

FineLine Technologies showcased barcode and RFID-integrated labeling solutions at Pack Expo International 2026, held 18-21 October at McCormick Place...

CJ Graphics to install first Heidelberg Jetfire 50 inkjet press in North America

CJ Graphics, a North American printing company, will be the first customer on the continent to install a Heidelberg...
- Advertisement -spot_img

Jesons to launch Bondex specialty label adhesives at LOUPE India 2026

Jesons Industries will launch its Bondex range of specialty label adhesives at LOUPE India 2026 (formerly Labelexpo India), a...

How real-time process visibility helps coating and converting manufacturers improve quality, reduce waste and operate more efficiently

In today's coating and converting industry, manufacturers face growing pressure to deliver consistent quality while improving productivity and controlling...

Must read

TCPL orders two MK 1060YM foil-stamping and diecutting equipment from Heidelberg

L – R: Peter Rego, business unit head, equipment...

Tomra unveils automated collection point for reusable takeaway packaging

Tomra has introduced its new Reuse Collection Point (RCP)...

You might also likeRELATED
Recommended to you