Sunday, October 18, 2026
Consumables“India is the future China for us” – Wladimir...

“India is the future China for us” – Wladimir Moraes

-

“India is the future China for us” – Wladimir Moraes

-
Wladimir Moraes, marketing manager, global flexible packaging; and Daniel Thong, regional market manager, flexible packaging, Bostik. Photo: The Packman

At PackPlus 2019, Bostik highlighted two of its solvent-free adhesive products LF 225 and H300M. “The two products have excellent wettability on metallized films. The products can run PET/MPET substrates with good optics up to 250 m/min, and can solve a common problem of poor appearance (speckling) using solvent-free laminating adhesives at higher lamination speeds. Launched earlier this year, the products support high speed runs and have gone through extensive tests and trials before they were made available in the India market,” said Wladimir Moraes, marketing manager, global flexible packaging, Bostik.

“There was a need in the market for solvent-free adhesives and hence we developed the products which have same performance as solvent-based adhesive. The problem India converters are facing today is low speed while running solvent-free lamination of PET and metallized PET. So Bostik developed these two products which increase the lamination speed. The two products are developed specifically for the Indian market and are the most stable products offered by us for PET and MPET,” added Moraes.

Bostik is a leading global adhesive specialist in construction, consumer and industrial markets. Bostik started its operation in India in 1992 through an agreement between Coates India and Bostik UK. However, Bostik India separated from Coates in 2001 to become an entity by itself.

In 2018, Bostik India started a new plant in Gujarat to meet the increasing demand for adhesives in the industrial markets of India and South Asia. The new facility currently applies the latest manufacturing techniques to produce liquid adhesives for flexible lamination and footwear. It’s Bostik’s third plant in India with two other plants in Bangalore. In addition, the company has 15 warehouses and four sales offices with its headquarters in Bangalore.

“The Indian market is very important to us and that is why we are here today. It is the future China for us. The India market is growing very fast and that is why we have also set up our R&D unit here so that we can develop new products locally. Our strategy is to develop local products to address local needs of converters with our R&D team providing a very good technical support to the customers. We also want to bring in innovative products which we are globally selling quite successfully in Europe, North America and China to India,” said Moraes.

“With the growing urbanization and rising population of middle class consumers in India, the packaging industry is experiencing exponential growth. There is no better time than now to increase our presence in the industry. Two of the products that we’ve launched in India have also been supplied to other countries. The Gujarat plant has enough capacity to produce for the entire south-east Asian region. We’ve been supplying to these markets successfully in the last few years and have grown in these regions, thanks to the growth in the flexible packaging vertical,” said Daniel Thong, regional market manager, flexible packaging, Bostik.

Mahan Hazarika
Mahan Hazarika
Mahan Hazarika is the Editor of The Packman since 2017. Having spent more than a decade reporting on the printing and packaging industries, he brings a wealth of industry knowledge, perspective, and insight to his work. Outside the newsroom, Mahan is passionate about ZG music, travel, and films.

LEAVE A REPLY

Please enter your comment!
Please enter your name here

This site uses Akismet to reduce spam. Learn how your comment data is processed.

Latest news

Sun Chemical launches GIO-compliant SolarFlex FSP UV flexo inks

Sun Chemical has launched an upgraded SolarFlex FSP UV flexographic ink range for label and packaging manufacturers, designed to...

Eriez to showcase advanced inspection technologies at Pack Expo 2026

Eriez will highlight advanced inspection technologies at Pack Expo International 2026, 18–21 October, at McCormick Place in Chicago. Visitors...

artience Group, DIC introduce standard recyclability protocol for flexible film packaging

The artience Group, through its packaging solutions subsidiary Toyo Ink, and DIC Corporation have developed a common industry protocol...

SIG introduces SIG Neo filling machines for aseptic cartons

SIG has expanded its SIG Neo filling machine portfolio for aseptic cartons with two new machines: SIG Neo XSlim...
- Advertisement -spot_img

Tetra Pak launches ice cream packaging with new wrapping solution

Tetra Pak is extending its paper-based packaging expertise into the ice cream category with Tetra Pak ice cream wrap,...

Konica Minolta to showcase AccurioLabel 230 and 400 at LOUPE India 2026

Konica Minolta Business Solutions India will showcase its AccurioLabel 230 and AccurioLabel 400 digital label printing machines at LOUPE...

Must read

Huhtamaki acquires full ownership of its paper bag joint venture in Poland

Huhtamaki has acquired full ownership of its Polish joint...

Comexi’s new flexographic and digital press innovations at drupa 2024

At drupa 2024, Comexi introduced several innovations and technological...

You might also likeRELATED
Recommended to you