Wednesday, July 22, 2026
Consumables“India is the future China for us” – Wladimir...

“India is the future China for us” – Wladimir Moraes

-

“India is the future China for us” – Wladimir Moraes

-
Wladimir Moraes, marketing manager, global flexible packaging; and Daniel Thong, regional market manager, flexible packaging, Bostik. Photo: The Packman

At PackPlus 2019, Bostik highlighted two of its solvent-free adhesive products LF 225 and H300M. “The two products have excellent wettability on metallized films. The products can run PET/MPET substrates with good optics up to 250 m/min, and can solve a common problem of poor appearance (speckling) using solvent-free laminating adhesives at higher lamination speeds. Launched earlier this year, the products support high speed runs and have gone through extensive tests and trials before they were made available in the India market,” said Wladimir Moraes, marketing manager, global flexible packaging, Bostik.

“There was a need in the market for solvent-free adhesives and hence we developed the products which have same performance as solvent-based adhesive. The problem India converters are facing today is low speed while running solvent-free lamination of PET and metallized PET. So Bostik developed these two products which increase the lamination speed. The two products are developed specifically for the Indian market and are the most stable products offered by us for PET and MPET,” added Moraes.

Bostik is a leading global adhesive specialist in construction, consumer and industrial markets. Bostik started its operation in India in 1992 through an agreement between Coates India and Bostik UK. However, Bostik India separated from Coates in 2001 to become an entity by itself.

In 2018, Bostik India started a new plant in Gujarat to meet the increasing demand for adhesives in the industrial markets of India and South Asia. The new facility currently applies the latest manufacturing techniques to produce liquid adhesives for flexible lamination and footwear. It’s Bostik’s third plant in India with two other plants in Bangalore. In addition, the company has 15 warehouses and four sales offices with its headquarters in Bangalore.

“The Indian market is very important to us and that is why we are here today. It is the future China for us. The India market is growing very fast and that is why we have also set up our R&D unit here so that we can develop new products locally. Our strategy is to develop local products to address local needs of converters with our R&D team providing a very good technical support to the customers. We also want to bring in innovative products which we are globally selling quite successfully in Europe, North America and China to India,” said Moraes.

“With the growing urbanization and rising population of middle class consumers in India, the packaging industry is experiencing exponential growth. There is no better time than now to increase our presence in the industry. Two of the products that we’ve launched in India have also been supplied to other countries. The Gujarat plant has enough capacity to produce for the entire south-east Asian region. We’ve been supplying to these markets successfully in the last few years and have grown in these regions, thanks to the growth in the flexible packaging vertical,” said Daniel Thong, regional market manager, flexible packaging, Bostik.

Mahan Hazarika
Mahan Hazarika
Mahan Hazarika is the Editor of The Packman since 2017. Having spent more than a decade reporting on the printing and packaging industries, he brings a wealth of industry knowledge, perspective, and insight to his work. Outside the newsroom, Mahan is passionate about ZG music, travel, and films.

LEAVE A REPLY

Please enter your comment!
Please enter your name here

This site uses Akismet to reduce spam. Learn how your comment data is processed.

Latest news

Herma launches Linerless Plus label material with 62Dps adhesive

Herma has introduced Linerless Plus (400), a linerless label material using the multi-layer pressure-sensitive adhesive 62Dps for the first...

Koenig & Bauer and Siemens collaborate on next-generation software-defined machine architecture

The strategic partnership between Koenig & Bauer and Siemens, initiated one year ago, is progressing according to plan along...

HIPLEX 2026 Roadshow held in Hyderabad

The roadshow for HIPLEX 2026, India’s third-largest plastics exhibition, was held on Saturday night at ITC Kakatiya, Hyderabad, setting...

UFlex secures patent for advanced reclosable packaging for large-format bags

UFlex, India’s largest multinational flexible packaging and solutions company, has secured an Indian patent, valid for a period of...
- Advertisement -spot_img

FSSAI pulls up alcohol makers over misleading ‘aged’ claims, flavour violations

The Food Safety and Standards Authority of India (FSSAI) has issued notices to alcoholic beverage manufacturers over alleged violations...

Brilliant Polymers reinforces solvent-free leadership at ElitePlus 2026

At the 13th Speciality Films & Flexible Packaging Global Summit & Exhibition (ElitePlus 2026), Brilliant Polymers will showcase its...

Must read

Bobst introduces oneInspection quality control

Bobst has launched oneInspection, an integrated and evolving set...

Labelexpo India 2022: H.B. Fuller launches adhesive for precise die-cutting

H.B. Fuller has launched its first filled hot melt...

You might also likeRELATED
Recommended to you