Thursday, July 23, 2026
AwardsFull success for Luxe Pack Shanghai in green sessions

Full success for Luxe Pack Shanghai in green sessions

-

Full success for Luxe Pack Shanghai in green sessions

-

For the first time, Luxe Pack Shanghai has offered its exhibitors and prospects, training sessions on sustainable development and on Luxe Pack in green Awards. Taking place in Shanghai and Shenzhen late October, they encountered a full success with large attendance in both cities.

The interest for sustainable development of both suppliers and brands is booming in China and Luxe Pack Shanghai is the first and unique show to answer to these new requirements from the luxury sector. Luxe Pack Shanghai is the premier event in China, showcasing sustainable development for creative packaging and responsible companies.

Luxe Pack in green Awards were inducted in 2012, to shed light on all the exhibitors’ eco-conceived packaging solutions and from 2016, also on responsible initiatives from packaging companies.

Mahan Hazarika
Mahan Hazarika
Mahan Hazarika is the Editor of The Packman since 2017. Having spent more than a decade reporting on the printing and packaging industries, he brings a wealth of industry knowledge, perspective, and insight to his work. Outside the newsroom, Mahan is passionate about ZG music, travel, and films.

LEAVE A REPLY

Please enter your comment!
Please enter your name here

This site uses Akismet to reduce spam. Learn how your comment data is processed.

Latest news

Romaco India showcases blister packaging and tableting expertise at Hyderabad open house

Romaco India, the Sales & Service Centre of the Romaco Group, hosted a three-day open house at its Experience...

Epson to showcase on-demand color labeling and thermal printing solutions at Foodpro 2026

Epson will demonstrate its on-demand color labeling and thermal receipt printing solutions at Foodpro 2026, a food and beverage...

Herma launches Linerless Plus label material with 62Dps adhesive

Herma has introduced Linerless Plus (400), a linerless label material using the multi-layer pressure-sensitive adhesive 62Dps for the first...

Koenig & Bauer and Siemens collaborate on next-generation software-defined machine architecture

The strategic partnership between Koenig & Bauer and Siemens, initiated one year ago, is progressing according to plan along...
- Advertisement -spot_img

HIPLEX 2026 Roadshow held in Hyderabad

The roadshow for HIPLEX 2026, India’s third-largest plastics exhibition, was held on Saturday night at ITC Kakatiya, Hyderabad, setting...

UFlex secures patent for advanced reclosable packaging for large-format bags

UFlex, India’s largest multinational flexible packaging and solutions company, has secured an Indian patent, valid for a period of...

Must read

Bobst reveals new gravure press and capabilities for converters

Bobst hosted a gravure printing and laminating virtual event...

‘World first’ tea capsules made using Sabic’s Trucircle solution

Avoury, a new brand launched by Melitta Single Portions,...

You might also likeRELATED
Recommended to you