Friday, February 20, 2026
EventsAvery Dennison to showcase advanced solutions for South Asia...

Avery Dennison to showcase advanced solutions for South Asia at Labelexpo India 2024

-

Avery Dennison to showcase advanced solutions for South Asia at Labelexpo India 2024

-

Avery Dennison, an industry leader in materials science and digital identification solutions, will return to Labelexpo India this year, bringing new innovations to enhance sustainability, optimize the supply chain, and foster stronger connections between consumers and brands.

This year, Avery Dennison is set to offer converters and brand owners across South Asia an exclusive sneak peek into their latest innovations and solutions designed to connect the physical and digital to unlock new possibilities for the labeling industry.

“We are eagerly anticipating the opportunity to reconnect with our South Asian partners and showcase how our cutting-edge technologies can elevate their brands,” said Saurabh Agarwal, vice president and general manager, Materials Group, South Asia. “Our focus this year is on presenting a suite of advanced solutions that not only highlight our next generation label technology, but also how connected packaging solutions build consumer interaction and provide end-to-end transparency.”

This year’s stand will showcase a range of innovative products and solutions, including the Sustainable ADvantage portfolio, which features labels designed to minimize material use and promote recycling and reuse. Additionally, the specialty portfolio will highlight labels that enhance a brand’s premium appearance and include anti-counterfeiting solutions to meet growing regulatory and safety requirements. The company will showcase innovations for emerging markets like energy storage, EV batteries, solar, and mobile, offering high-performance bonding and labeling solutions. Avery Dennison’s extensive RFID portfolio will further bridge the gap between the physical and digital realms to unlock end-to-end traceability and enhance consumer engagement. Visitors will also discover unique services, including Avery Dennison’s customer portal, compliance, and their recycling program.

“At Avery Dennison, innovation is at the heart of everything we do. Our participation in Labelexpo India 2024 reflects our dedication to driving progress within the industry and supporting our customers’ efforts,” added Manoj KM, director, sales and technical services, Materials Group, South Asia. “We believe that by collaborating with our partners and sharing insights on the latest trends, we can collectively shape the future of labeling and packaging.”

Customers can also participate in the knowledge sessions that Avery Dennison will host throughout the event to gain deeper insight into the industry landscape and the work Avery Dennison is doing to help solve key industry challenges. Avery Dennison will be showcasing at Labelexpo India Stand C15.

NewsDesk
NewsDesk
The editorial team of The Packman who handle all the press releases with Sunil Jain working as the desk editor.

LEAVE A REPLY

Please enter your comment!
Please enter your name here

This site uses Akismet to reduce spam. Learn how your comment data is processed.

Latest news

Prymat adopts Mondi high-barrier paper for spice packaging

Prymat, the Polish dried seasoning manufacturer, has partnered with Mondi to transition from complex multi-layer packaging to a recyclable,...

drupa 2028 unveils new brand identity

drupa has unveiled a new brand identity ahead of the 2028 edition, offering an early indication of the trade...

Trivium wins WorldStar Global Packaging awards 2026

Trivium Packaging, a global supplier of metal packaging, has won a 2026 WorldStar Global Packaging award from the World...

Inovar acquires Kiliper

Inovar Packaging Group, a leading provider of innovative and sustainable label printing and packaging solutions, has acquired Kiliper Corporation...
- Advertisement -spot_img

Epson to showcase smart color labeling for organic foods at Expo West 2026

Epson will exhibit at the 45th annual Natural Products Expo West event, located at the Anaheim Convention Center from...

UFlex brings circular thinking to inks and coatings

UFlex’s Chemicals Business is rethinking what sustainability really means for printing — moving the conversation away from compliance and...

Must read

Bobst AluBond: A breakthrough in high metal adhesion

The Bobst AluBond process provides high metal adhesion and...

Wacker’s innovative polymer resin binders at European Coatings Show

Wacker is all set to unveil its Vinnol solid...

You might also likeRELATED
Recommended to you