Wednesday, March 11, 2026
LabelsAvery Dennison felicitates winners of ‘Spirit of Invention’ scholarship

Avery Dennison felicitates winners of ‘Spirit of Invention’ scholarship

-

Avery Dennison felicitates winners of ‘Spirit of Invention’ scholarship

-

With the aim to recognize and reward academic excellence and outstanding innovation capabilities in students studying in the fields of science, engineering & technology, Avery Dennison Foundation has announced 10 winners under its Spirit of Invention (InvEnt) Scholarship Scheme. In its 2019 edition of InvEnt, Avery Dennison felicitated 10 scholars from premier institutes in an award ceremony organized in Gurgaon.

Each year, Avery Dennison Foundation, the philanthropic arm of Avery Dennison Corporation in collaboration with the Institute of International Education (IIE), honors 10 Indian students to encourage and support leadership & innovation development among the students. This year, 10 winners belonging to 5 premier institutes received the scholarship of US$ 1300 each and an opportunity to participate in a special workshop on invention & innovation conducted by the Avery Dennison Foundation.

The five premier institutes include:

  1. Delhi Technological University, Delhi
  2. Indian Institute of Technology, Bombay
  3. MKSSS’s Cummins College of Engineering for Women, Pune
  4. M. S. Ramaiah Institute of Technology, Bengaluru
  5. National Institute of Technology, Tiruchirappalli

This year marks the 8th edition of InvEnt, an Avery Dennison Foundation Initiative to recognize and reward invention, innovation and excellence among the budding talent in India.

Speaking on the occasion, Alicia Procello, president, Avery Dennison Foundation said, “Avery Dennison Foundation is committed to fostering talent and nurture creativity to inspire students to think innovatively. Through InvEnt scholarship, we aim to promote the spirit of innovation and entrepreneurship among the students by providing a platform to express innovative ideas, inculcate fresh thinking and pursue their passion. We congratulate the winners for demonstrating a high level of creativity and we will continue to support talented students and build innovators of tomorrow”.

Speaking on the occasion, Pankaj Bhardwaj, general manager and senior director, Avery Dennison India said, “We continue to extend our legacy and make a difference to the communities that we live in. InvEnt helps us to achieve a major part of this goal through supporting and honoring the talent, exactly where it matters the most. Furthermore, we are making conscious efforts to extend our community services to the areas of women empowerment and child education around our offices and factories. Our partnership with the likes of National Skills and Development Center, Read India and Rotary International is helping us in this pursuit.”

Started in India in 2012, the winners under the Avery Dennison Foundation Spirit of Invention (InvEnt) Scholarship Programme are selected through a merit-based, rigorous three-stage selection process. It is the eighth edition of the awards and a total of 80 scholarships to date, have been given.

NewsDesk
NewsDesk
The editorial team of The Packman who handle all the press releases with Sunil Jain working as the desk editor.

LEAVE A REPLY

Please enter your comment!
Please enter your name here

This site uses Akismet to reduce spam. Learn how your comment data is processed.

Latest news

ASPA, Keshav Kumar to unveil white paper on food adulteration

The Authentication Solution Providers' Association (ASPA), in collaboration with Keshav Kumar, IPS (Retd.), Ph.D., forensic advisor to the government...

Homefoil introduces grease-proof paper at Aahar 2026

Homefoil, the premium consumer brand of LSKB Aluminum Foils, has expanded into the paper-based packaging segment with the launch...

Henkel to present sustainable can packaging innovations at Metpack 2026

Henkel Adhesive Technologies will present its latest solutions for efficient, safe, and sustainable metal packaging at Metpack 2026. Its...

Soudronic to showcase can welding innovations at Metpack 2026

Metpack 2026 will serve as the platform for Soudronic to highlight its latest developments in welding technology for the...
- Advertisement -spot_img

Koenig & Bauer to showcase future of metal decorating at Metpack 2026

At Metpack 2026 in Essen, 5–8 May, Koenig & Bauer MetalPrint will present its most powerful lineup to date....

Gulf Print & Pack rescheduled for September 2026

Gulf Print & Pack, the MENA region’s leading print and packaging technology trade event, will now take place from...

Must read

UFlex reports total net revenue of INR 36,825 million in Q1 2024

UFlex has announced its unaudited consolidated net revenue for...

FIG ties up with French company DCM ATN

Flexo Image Graphic, a one-stop distributor and service provider...

You might also likeRELATED
Recommended to you