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UPM Raflatac joins Sustainable Packaging Coalition

Mahan Hazarika -
UPM Raflatac is joining the Sustainable Packaging Coalition (SPC). The coalition is a membership-based collaborative led by an independent nonprofit that believes in the...

Chinese firm Caihua installs 8-color Comexi CI8 offset press

NewsDesk -
Comexi, specialist in solutions for the flexible packaging industry, and Caihua, multinational company based in China, reinforce their strategic alliance. The Chinese firm has...

Puratos hosts first ever Indian edition of flagship patisserie event

NewsDesk -
Event marked with presence of recognized speakers from Mintel, Euromonitor, ITC-Hotel Division, Auto Bake Productions and Packaging Consultant who have been ex-Unilever India packaging...

Mumbai-based EGK’s fresh packaged fried onions

Manash Das -
There is a yearly wastage of 5 million metric tonnes of onions produce in India (25% of the total yield). EGK Foods Pvt Ltd...

UV and LED solutions for printing labels at Lablexpo Europe

Mahan Hazarika -
At the Labelexpo in Brussels, IST METZ will present the MBS range with its standard Hot Swap functionality at booth 5D21. In addition, the...

ACG Group appoints Richard Stedman as Group CEO

Mahan Hazarika -
ACG, a global supplier of integrated manufacturing solutions for leading pharmaceuticals and nutraceutical companies, has hired Richard Stedman as Group CEO for its Engineering...

Toray to debut Imprima waterless offset plates at Labelexpo Europe 2017

Mahan Hazarika -
Toray Graphics in the Czech Republic, a leading manufacturer of waterless offset plate technology, will be bringing its brand new Imprima line of waterless...

H.B. Fuller Company agrees to purchase Adecol

Mahan Hazarika -
H.B. Fuller Company has signed an agreement to purchase adhesives company, Adecol Ind. Química, Limitada, a highly respected manufacturer of quality adhesive technologies in...
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ebeam Technologies opens R&D center in Japan

ebeam Technologies, the developer and manufacturer of electron beam (ebeam or EB) solutions is boosting EB innovation in Japan with the launch of its...
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Bosch to launch integrated system solution for liquid and viscous food

At Pack Expo International 2016 in Chicago, Illinois from 6 to 9 November 2016, South Hall, Stand S-3514, Bosch Packaging Technology will debut its integrated system...
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Sustainability, efficiency and product safety at PACK EXPO Las Vegas

Sustainability, efficiency and product safety are among the top issues to be addressed with the latest packaging technology at PACK EXPO Las Vegas (Las...
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Altana acquires Landa’s Metallography tech

Specialty chemicals firm Altana has acquired Landa’s Metallography technology, which was first unveiled by Landa at drupa in June 2016. The novel technology for...

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