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TCPL orders two MK 1060YM foil-stamping and diecutting equipment from Heidelberg

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L – R: Peter Rego, business unit head, equipment sales, Heidelberg India; Abhishek Kanoria; Saket Kanoria, managing director, TCPL Packaging; Michael Gao of MK...

Strong German presence at International PackTech India and FoodPex India

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Several major German brands will be represented at the International PackTech India and FoodPex India, held at the Bombay Convention & Exhibition Centre in...

Rukson installs Esko’s Kongsberg XE10 and packaging software

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L – R: Gobind Panjabi, director, Rukson Packaging; Kishan Panjabi, director Rukson Packaging; John Winderam, GM, Esko; and Umesh Kagade, channel manager, Esko Navi Mumbai-based...

B&R to presents mapp technology for the plastics industry

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At K 2016, from 19 to 26 October, B&R will be demonstrating how to greatly simplify the development of applications for injection presses, extruders...

Rotoflex to show finishing solutions at Labelexpo Americas

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On the Mark Andy Stand 319 during Labelexpo Americas 13 to 15 September, Rotoflex is set to present a wide array of offline finishing...

Bosch to launch integrated system solution for liquid and viscous food

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At Pack Expo International 2016 in Chicago, Illinois from 6 to 9 November 2016, South Hall, Stand S-3514, Bosch Packaging Technology will debut its integrated system...

Esko to display Kongsberg X24 cutting table at IndiaCorr Expo 2016

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At IndiaCorr Expo – SinoCorrugated 2016 scheduled for 8 to 10 September 2016 at Bombay Exhibition Centre, Goregaon East in Mumbai, India, Esko will...
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