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interpack 2017 records strong demand among exhibitors

interpack 2017 is recording the highest demand among exhibitors in its history of over 55 years. By the official closing date of this outstanding...

ebeam Technologies opens R&D center in Japan

ebeam Technologies, the developer and manufacturer of electron beam (ebeam or EB) solutions is boosting EB innovation in Japan with the launch of its...

Pragati and Caxton invest in SBL diecutter and folder-gluer

At the recently concluded PrintPack India 2017 exhibition, Hyderabad-based Techno Graphic Services (TGS) announced two major sales of its SBL diecutter and folder-gluer. While...

Perfect Flexitech buys third intaGlios from Monotech Systems

Kanpur-based Perfect Flexitech bought its third intaGlios gravure cylinder engraver from Monotech Systems at Printpack India 2017. The deal took place on the second...

Clariant to expand plant in Lewiston

Clariant announced that it will expand its plant in Lewiston, ME, and install a new compounding line to help meet growing demand for pre-colored...

Chennai-based Tridev invests in Mark Andy 2200 label press

Chennai-based Tridev Labels has invested in a Mark Andy 2200 label press for the production of self-adhesive labels. Tridev Labels is a leading manufacturer...

Hinojosa to install world’s first EFI Nozomi C18000 single-pass LED inkjet press

Electronics For Imaging  announced that Xátiva, Spain-based Rafael Hinojosa, a technological leader in integrated packaging product development and converting, signed an agreement to install the...

Qualvis Print & Packaging achieves world’s first with digital investment

Leicester-based Qualvis Print & Packaging has become the first packaging company globally to install a double digital packaging line. The workflow investment, totaling over £2m,...

Must Read

Mondi to showcase BarrierPack Recyclable at FachPack 2018

Mondi, the global packaging and paper group, will highlight BarrierPack Recyclable, its fully recyclable plastic laminate for pre-made pouches and FFS roll stock, along...

Esko announces Prepress Innovation Tour ‘17

Experiencing customer proximity and strengthening understanding of the future of packaging prepress is critical to product development strategy. Building on its successful tour across...

Bosch to launch integrated system solution for liquid and viscous food

At Pack Expo International 2016 in Chicago, Illinois from 6 to 9 November 2016, South Hall, Stand S-3514, Bosch Packaging Technology will debut its integrated system...

Labelexpo India 2016 celebrates a successful edition

Labelexpo India 2016 closed its most successful show to date on 20 November. Held at its new home for the first time, the India...

Esko to display Kongsberg X24 cutting table at IndiaCorr Expo 2016

At IndiaCorr Expo – SinoCorrugated 2016 scheduled for 8 to 10 September 2016 at Bombay Exhibition Centre, Goregaon East in Mumbai, India, Esko will...