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Mondi enables label-free packaging of 35,000 parcels daily for Komsa

Mondi, a global leader in sustainable packaging and paper, has expanded its portfolio with a high-performance digital printing solution, enabling customized, high-volume packaging following...

Konica Minolta showcases full digital portfolio at Print Expo 2025

Konica Minolta Business Solutions India unveiled the next generation of production printing innovation at Print Expo Chennai 2025 with the official launch of the...

Epson celebrates 50 years of its iconic brand

On 17 July 2025, Epson celebrated its 50th anniversary since the incorporation of its brand. Over the past five decades, Epson has grown into...

SUN Automation introduces QPM program for corrugated packaging

SUN Automation Group, a global leader in providing innovative solutions to the corrugated industry, has launched the PERFORM+, a new Quarterly Preventative Maintenance (QPM)...

Aptar Beauty wins packaging innovation award for Nomad Refill

Aptar Beauty’s Nomad Refill solution has won the Best Packaging Innovation for Perfumery award at the 2025 Barcelona Perfumery Awards. The award was presented...

Huhtamaki launches new compostable ice cream cups

Huhtamaki, a global leader in sustainable food packaging solutions, has launched its new ice cream cups that combine product innovation with consumer appeal. These...

hubergroup launches water-based inks and varnishes for direct food contact

hubergroup Print Solutions has introduced its new modular Hydro-X Contact system – a next-generation solution for water-based inks and overprint varnishes. The system is...

FIG with principals shows success at LMAI Conference 2025

Flexo Image Graphics (FIG), a leading distributor and service provider of flexo presses and associated equipment from the world’s leading brands in the Indian...

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Neste and Lotte Chemical team up on renewable chemicals and plastics

Neste and South Korean chemical company Lotte Chemical are teaming up to make chemicals and plastics more sustainable. The companies embark on a strategic...

Labelexpo Asia 2023 promises new press technology

Labelexpo Asia 2023 is gearing up for its 20th-anniversary celebration at the Shanghai New International Expo Center (SNIEC) from December 5 to 8. Anticipating...

Open Automation Challenge 2024 – shaping engineers of the future

At a time when the global manufacturing landscape is more competitive than ever, industry and academia are collaborating to overcome complex new challenges in...

Syntegon to showcase robotics and automation solutions at Pack Expo 2021

Syntegon Technology will present its latest processing and packaging solutions at Pack Expo in Las Vegas from 27 to 29 September 2021. The focus...

HP, ePac sign USD 50 million deal

HP and ePac have signed a new large-scale commercial agreement valued at approximately USD 50 million over three years, covering equipment, consumables, and services. Over...