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LPA’s 5th Mega Event – another successful printers’ conclave

Mahan Hazarika -
Lucknow Printers’ Association’s 5th Mega Event, The Printers’ Conclave, which took place at Chancellor’s Club in Lucknow on 18 November 2017 was once again...

Toyo Ink SC Holdings to expand business in Turkey

Mahan Hazarika -
Toyo Ink SC Holdings Co., Ltd., the parent company of the Toyo Ink Group of companies, announced today that its subsidiary company Toyo Printing...

BST eltromat India displays robust, durable and easy-to-maintain products at Paperex 2017

Mahan Hazarika -
At the Paperex exhibition which took place in New Delhi from 1 to 4 November 2017, BST Eltromat India displayed its range of products...

Anantshree Chaturvedi: Uflex aims at healthier bottom-line for profit reinvestment

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In end-October 2017, The Packman met with Anantshree Chaturvedi, vice chairman and chief executive officer, Flex Films International – the global film manufacturing arm...

TCPL leaves its mark in flexible packaging on its first anniversary

Mahan Hazarika -
When TCPL first launched its flexible packaging unit a year ago, in September 2016, the company was among the leading players in the monocarton...

Flexibiz ERP gains momentum in Indian packaging market

Mahan Hazarika -
Delhi-based Kiran Consultants recently implemented CRM and ERP solutions at Bankey Bihari Packaging, Zedpack Private Limited and Marudhara Polypack Private Limited with a user...

APL Machinery promotes sister company SPS at IndiaCorr Expo

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  At IndiaCorr Expo 2017, 14 to 16 September, APL Machinery promoted it’s sister company Smart Printech Solutions (SPS). The company shared a joint stand...

Uflex launches ASEPTO Smart 78, the first ever aseptic liquid filling machine made in India

Mahan Hazarika -
What Uflex Limited recently did is a perfect pedagogy for the packaging industry on how smart and seamless dovetailing of existing resources, domain knowledge...
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Avery Dennison integrates Pragmatic Semiconductor’s chip on a mass scale

Avery Dennison is enhancing its Near Field Communication (NFC) inlay portfolio with a flexible integrated circuit (FlexIC) product line, NFC Connect, from Pragmatic Semiconductor. The...
Industry News

Vinsak unveils innovations in finishing, embellishment and sustainability at Labelexpo India

At Labelexpo India 2024, Ranesh Bajaj, director of Vinsak, spoke about the company’s latest advancements and innovative solutions, showcasing products designed to address the...
Track and Trace

Mark Andy to host RFID smart-label workshop in Warsaw

Registration is now open for the RFID technology workshop at the Mark Andy demo center in Warsaw on 12 March 2026. The workshop will...
drupa 2024

Heidelberg CEO reveals game-changing innovations for printing industry at drupa 2024

In this interview, Dr. Ludwin Monz provides insights into the innovative solutions that Heidelberg offers for key industry challenges. He discusses the strategic decision...
Events

Labelexpo India 2018 forum in Colombo a grand success

The ball is now rolling for the big event of the year – Labelexpo India 2018 – following a successful forum in Colombo, on...

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