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‘Think Out Of The Box’ – Heidelberg shows packaging solutions for the digitized future

In the middle of May, more than 400 guests from all over the world attended the Packaging Day hosted by Heidelberger Druckmaschinen AG (Heidelberg)...

Trelleborg’s offset blanket solutions for packaging industry

  Trelleborg’s printing solutions operation will be attending the forthcoming ProPak Asia event, 13 – 16 June, with its range of Sava offset blanket solutions...

Printpack India 2019 sets stage for a record-setting edition

The Indian Printing Packaging & Allied Machinery Manufacturers’ Association (IPAMA) has received more than 300 confirmed bookings of space as on 22 May 2018...

Creative Edge Software Showcases Real-Time Ray Tracing for iC3D

Creative Edge Software, developer of the award-winning all-in-one iC3D packaging design software, showcased its latest technology breakthrough at parallel events in Milan and New York in May...

Resounding success for first Labelexpo Southeast Asia 2018

The launch edition of Labelexpo Southeast Asia – the biggest label and package printing event in the region – has exceeded all expectations, with...

Bobst launches first connected label press at Labelexpo Southeast Asia

  The Bobst exhibition stand at the recent Labelexpo Southeast Asia exhibition in Bangkok, Thailand, was filled to capacity every day of the show after...

UBM India announces CPhI’s 7th Annual Pharma Confex in Mumbai

CPhI Conferences, a division of UBM India, which hosts a number of successful pharmaceutical conferences, has announced its premier event, ‘The 7th Annual Innopack...

PackPlus ready for another show in Delhi

  Industry is business ready for the next edition of the total packaging, processing and supply chain event, which will take place between 25-28 July at Pragati Maidan, New...

Must Read

interpack 2020 completely booked out

Messe Düsseldorf, the organizers of interpack 2020 – leading trade fair for the processing and packaging industry, arranged media and industry interaction in Delhi...

Xeikon to head to Labelexpo Asia with innovative digital label solutions

Xeikon will be joined by the Flint Group’s Narrow Web and Ink divisions at Labelexpo Asia 2017, scheduled for 5 to 8 December 2017...

Registration opens for Labelexpo Asia 2021

Registration for Labelexpo Asia 2021 is now open. The event takes place at the Shanghai New International Expo Centre in Shanghai, China, between 7-10...

Südpack debuts at Seed meets Technology

From 24 to 26 September 2024, the Seed meets Technology event in Zwaagdijk-Oost, Netherlands (near Amsterdam) will focus on innovations in the horticulture industry...

UFlex exhibits range of innovative printing and packaging solutions at Plastindia 2023

UFlex, India’s largest multinational flexible packaging and solutions company, is exhibiting its wide range of printing cylinders, inks, adhesives, coatings, advanced printing, laminating, and...