Friday, October 23, 2026
ConsumablesUFlex Chemicals gets India patent for solvent-free pigmented adhesive

UFlex Chemicals gets India patent for solvent-free pigmented adhesive

-

UFlex Chemicals gets India patent for solvent-free pigmented adhesive

-
UFlex Chemicals gets India patent

As one of the global leaders in inks, coatings and adhesives for packaging and labeling applications, UFlex treads on the path of continuous development and delivery of pioneering products for the packaging industry. The Chemicals Business of UFlex has recently acquired a patent for ‘solvent-free pigmented adhesive and a process for its preparation’ (Patent No 406417). With this patent, the Chemicals Business of UFlex has once again demonstrated its commitment to harvesting innovation.

This patent has been awarded to UFlex by the Government of India in accordance with the provisions of the Patents Act, 1970 for a period of 20 years. UFlex adds this patent to develop innovative and sustainable solutions to its growing list of leading-edge products.

The present disclosure relates to a two-component adhesive composition and the process for its preparation. The adhesive composition of the present disclosure is solvent-free and works well on existing solvent-less lamination machines. It helps reduce the use of white ink, thus significantly reducing costs. The process for the preparation of the adhesive composition is simple, efficient, solvent-free and environment friendly.

The presence of high content of volatile organic solvents in solvent-based conventional adhesives is detrimental to the environment and is energy-intensive, thereby increasing overall costs. With the development of this solvent-free white adhesive, the customer gets the freedom to be green and cost-effective at the same time.

Advantages of the patented

The adhesive will help achieve higher machine speeds ranging from 300-350 meters per minute, leading to higher productivity with excellent machinability on existing solvent-less lamination machines. This development will cut down the requirement of white ink coating on printed substrates, thereby presenting substantial cost savings. Solvent-free pigmented white adhesive offers excellent wettability, offer enhanced wettability on metalized substrates and improves the look of the packaging. Development of Solvent-free pigmented white adhesive consumes less power and significantly reduces application costs. The fast decay of primary aromatic amines makes it highly environment friendly and sustainable.

On acquiring the adhesive patent, Rajesh Bhasin, joint president, UFlex Chemicals said, “Continuously developing cost-effective and value-added solutions for the packaging industry is integral to our business. Our research team has been continuously working diligently to outperform our own set benchmarks. This patent is another feather in the cap of UFlex Chemicals, and once again demonstrates our capability to align with client needs while promoting sustainability. I am thrilled that a cost-effective and versatile solvent-free white adhesive is now a reality we will be able to deliver.”

NewsDesk
NewsDesk
The editorial team of The Packman who handle all the press releases with Sunil Jain working as the desk editor.

LEAVE A REPLY

Please enter your comment!
Please enter your name here

This site uses Akismet to reduce spam. Learn how your comment data is processed.

Latest news

V-Shapes offers snap and squeeze unit-dose packs for gels, liquids, and creams

V-Shapes, an Italian packaging company that describes itself as a global leader in snap and squeeze mono-dose packaging, offers...

Kongsberg PCS and Parksons Packaging mark 25 years of partnership

Kongsberg Precision Cutting Systems (PCS) and Parksons Packaging are marking 25 years of partnership, which began in 2001 when...

100 years of Heidelberg in Japan

Heidelberg will celebrate its 100th anniversary in Japan in 2026. For a century, the company has been supporting the...

Esko to showcase Quartz Flexo platemaking ecosystem at LOUPE India 2026

Esko will showcase its Quartz ecosystem for digital flexo platemaking at LOUPE India 2026, held from 29 October to...
- Advertisement -spot_img

Kurz India to showcase surface embellishment technologies at LOUPE India 2026

Kurz India will showcase 'Future of Surface Embellishment' at LOUPE India 2026, being held from 28 October to 1...

W&H launches Oneflex modular CI flexo press for flexible packaging

Windmöller & Hölscher (W&H) has launched Oneflex, a new modular CI flexographic printing press for flexible packaging production, which...

Must read

Digital packaging market sees surge – insights from Redington VP

During Pamex, we engaged in a conversation with Ramesh...

“Raw material prices will remain a challenge for the ink industry even in the next year” – JK Sharma of Yansefu

Yansefu is a leading manufacturer of high-performance printing inks,...

You might also likeRELATED
Recommended to you