Tuesday, April 7, 2026
EventsPackPlus Delhi at Pragati Maidan in August 2019

PackPlus Delhi at Pragati Maidan in August 2019

-

PackPlus Delhi at Pragati Maidan in August 2019

-

In the backdrop of the enormous success of the last edition, PackPlus is all aimed to make it big, once again in 2019. With 200+ exhibitors having already signed up for the show, the event is expected to be sold out months before the scheduled date.

Co-located with CartonTech, SupplyPlus, PackSol and India Converting Show, PackPlus will be held from 28-31 August 2019 at Pragati Maidan, New Delhi. In 2018, the event featured 400+ exhibitors which attracted a footfall of more than 20,000 visitors.

The show will be spread over 11 halls of Pragati Maidan and will present exhibitors from all parts of India and neighbouring countries. The event will be attended by important decision makers and specifiers from top and middle management from various industries including pharmaceutical and chemical; food and beverage, dairy and meat; engineering; garments and textiles; personal care products and logistics. Printers, converters, packaging professionals and packaging end-users as well as the providers of materials, equipment and services is also expected to the show visit in large numbers.

The exhibitors will span across three major segments –Primary Packaging and Automation, Supply Chain and Material Handling; and Flexible Packaging, Converting and Corrugation.

The Delhi edition of PackPlus also hosts a one-day knowledge sharing interactive session at International Packaging Conclave.

NewsDesk
NewsDesk
The editorial team of The Packman who handle all the press releases with Sunil Jain working as the desk editor.

LEAVE A REPLY

Please enter your comment!
Please enter your name here

This site uses Akismet to reduce spam. Learn how your comment data is processed.

Latest news

Komori India garners strong response at National Printing Expo 2026

New business opportunities driven by the latest and upgraded models of Komori India’s Lithrone and Enthrone sheet-fed offset presses,...

Hybrid Software adds AI to Artflow, enhances iC3D

Hybrid Software Brandz, a leading provider of artwork management and packaging visualization software for brands, FMCG manufacturers, design agencies...

Auxilium to open materials science lab in partnership with Flexcon

Auxilium Worcester, an accelerator and innovation studio supporting early-stage technology companies, will open a state-of-the-art materials science lab in...

Heidelberg concludes successful Expoprint 2026

Heidelberg has drawn a positive conclusion from its participation in Expoprint & Converflexo Latin America 2026, held from 24...
- Advertisement -spot_img

Smag-X acquires Codimag

Smag-X’s acquisition of Codimag’s assets has been approved by Évry Commercial Court. The approval was granted on 31 March...

Actega to showcase next-gen metal packaging solutions at Metpack 2026

Actega, manufacturer of specialty coatings, inks, adhesives, sealants and compounds for the print and packaging industry, will participate in...

Must read

Uflex’s brand Asepto to showcase visually stunning holographic innovation excellence at Pro2Pac

To introduce the concept of new-age aseptic liquid packaging...

Toyo-Morton develops solvent-free laminating adhesives

Toyo-Morton, Japan’s largest manufacturer of laminating adhesives and a...

You might also likeRELATED
Recommended to you