Wednesday, October 21, 2026
LabelsLOUPE India 2026: HP to introduce Indigo 6K+ digital...

LOUPE India 2026: HP to introduce Indigo 6K+ digital press

-

LOUPE India 2026: HP to introduce Indigo 6K+ digital press

-

HP will introduce the HP Indigo 6K+ Digital Press at LOUPE India 2026. Built on the HP Indigo 6K platform, the new press is designed to support the evolving needs of digital label production with improved productivity, operational reliability and versatility.

The label and packaging industry has been seeing rising demand for shorter print runs, faster turnaround times, multiple SKUs and greater application diversity. The HP Indigo 6K+ has been developed to address these requirements. Equipped with the new SmartControlSystem, the press incorporates intelligent automation and enhanced precision, which the company said will help converters improve operational efficiency and support business growth.

The HP Indigo 6K+ also introduces advancements in AI-powered tools, automation, scalability and press robustness. The platform has been designed to help converters improve uptime while providing the flexibility to adapt to evolving market requirements.

NewsDesk
NewsDesk
The editorial team of The Packman who handle all the press releases with Sunil Jain working as the desk editor.

LEAVE A REPLY

Please enter your comment!
Please enter your name here

This site uses Akismet to reduce spam. Learn how your comment data is processed.

Latest news

Kurz India to showcase surface embellishment technologies at LOUPE India 2026

Kurz India will showcase 'Future of Surface Embellishment' at LOUPE India 2026, being held from 28 October to 1...

W&H launches Oneflex modular CI flexo press for flexible packaging

Windmöller & Hölscher (W&H) has launched Oneflex, a new modular CI flexographic printing press for flexible packaging production, which...

UPM, Uteco and Siegwerk introduce a paper-based solution for secondary packaging

UPM Specialty Materials, Siegwerk and Uteco have developed a paper-based solution for secondary packaging. UPM provides the barrier base...

FineLine Technologies showcases RFID and barcode labeling at Pack Expo 2026

FineLine Technologies showcased barcode and RFID-integrated labeling solutions at Pack Expo International 2026, held 18-21 October at McCormick Place...
- Advertisement -spot_img

CJ Graphics to install first Heidelberg Jetfire 50 inkjet press in North America

CJ Graphics, a North American printing company, will be the first customer on the continent to install a Heidelberg...

Jesons to launch Bondex specialty label adhesives at LOUPE India 2026

Jesons Industries will launch its Bondex range of specialty label adhesives at LOUPE India 2026 (formerly Labelexpo India), a...

Must read

Food safety begins with the pack – FSSAI calls for stronger packaging compliance

Packaging material manufacturers are set to face greater scrutiny...

Quality control of metal decoration lines

Sacmi will present the new MVS (metal vision system)...

You might also likeRELATED
Recommended to you