Monday, August 3, 2026
EventsLabelexpo India 2022 opens doors

Labelexpo India 2022 opens doors

-

Labelexpo India 2022 opens doors

-
Labelexpo India 2022 opens
Packed with more than 250 exhibitors, this year’s show has more new technology than ever before. Photo: The Packman

Returning after four years, Labelexpo India 2022, South Asia’s leading exhibition for the labels and packaging printing industry, started on 10 November 2022 and will take place until 13 November 2022 at India Expo Mart & Centre, Greater Noida.

Packed with more than 250 exhibitors, this year’s show has more new technology than ever before and is an unmissable opportunity to experience the latest launches from leading industry names including Avery Dennison, BST, GEW HP, Konica Minolta, Bobst, DuPont, Esko, Miraclon, Monotech Systems and more.

The show was opened by Pradeep Saroha, event director of Labelexpo India, Rajesh Nema, president of Labels Manufacturers Association of India (LMAI), Jaideep Singh, honorary secretary, LMAI, Raveendra Joshi, president of All India Federation of Master Printers, Kamal Mohan Chopra, president, World Print & Communication Forum, AVPS Chakravarthi, Global Ambassador of World Packaging Organisation, Mohammad Shamsul Islam senior vice chairman of Printing Industry Association of Bangladesh, Peter Deckker, president of Sri Lanka Association of Printers and Andy Thomas-Emans, strategic director of Tarsus Labels, Packaging and Brand Print Group.

Saroha said, “We are very happy to be back at with Labelexpo India after a gap of four years. Despite the challenges of Covid, the label and package printing industry did not stop innovating in the past couple of years. We are thankful to all of our exhibitors for their unwavering support for Labelexpo India. This year’s show is packed with innovation and technology developments that took place in the past four years.”

Rajesh Nema, president of Labels Manufacturers Association of India, said, “I am very happy to be a part of the opening ceremony of Labelexpo India 2022. I look forward to meeting the whole label fraternity during the four-day show. The show is a crucial event for growth and development of the labels and packaging printing industry. The Tarsus team has done an excellent job of organizing the show. I am looking forward to seeing new technologies and products from some of the leading manufacturers in the industry.”

NewsDesk
NewsDesk
The editorial team of The Packman who handle all the press releases with Sunil Jain working as the desk editor.

LEAVE A REPLY

Please enter your comment!
Please enter your name here

This site uses Akismet to reduce spam. Learn how your comment data is processed.

Latest news

Sidel unites young engineers for industrial innovation

Nineteen engineering students from ten countries have completed Sidel’s Nextgen Innovation Lab, a three-week programme exploring real-world challenges in...

UFlex, India’s largest multinational packaging and solutions company, has commissioned its first overseas woven polypropylene (WPP) bags manufacturing plant,...

Vinsak to exhibit and lead panel discussions at Flexo Summit Asia 2026

Vinsak Group will participate in Flexo Summit Asia, taking place in Bengaluru on 5-6 August 2026, an event bringing...

Shivtek Spechemi to invest INR 150 crore in greenfield plant

Shivtek Spechemi Industries, a flagship company of the Shiva Group of Industries, has acquired approximately 21 acres of industrial...
- Advertisement -spot_img

Avery Dennison inaugurates distribution centre in Bengaluru

Avery Dennison South Asia inaugurated its new distribution center in Bengaluru, describing the move as part of the company’s...

Siegwerk launches FastMatch Cloud color management solution

Siegwerk, a global provider of printing inks and coatings for packaging applications and labels, has launched Colorwerk FastMatch Cloud,...

Must read

New leadership at Bosch Packaging Technology

Stefan König (51) will become president of Bosch Packaging...

Vilsa Nix-Pack – adhesive dots that repackage the six-pack

How can plastic be saved, CO₂ reduced and functionality...

You might also likeRELATED
Recommended to you