Holostik, a global leader in anti-counterfeiting and packaging security solutions, is set to make a significant impact at PackPlus 2025, taking place from 31 July to 2 August 2025, at Pragati Maidan, New Delhi. At Stand A54, the company will present its comprehensive range of innovative solutions that integrate physical and digital technologies.
A key highlight of Holostik’s showcase is its award-winning eco-friendly Paperogram. Moving away from traditional plastic-based holographic materials, these paper-based holograms align with global sustainability goals, offering greener packaging alternatives without compromising security.
Holostik will also demonstrate its advanced holography transfer technologies, enabling holographic features to be applied directly onto paperboard and mono cartons. This breakthrough enhances the versatility and aesthetic appeal of holographic security features in paper-based packaging, ensuring both protection and visual excellence.
In addition, Holostik’s expertise in metallization will be showcased through its transparent holography products, such as HRI and Allox. These transparent holograms combine high-level security with product visibility, allowing consumers to see the contents within the packaging laminate. This fusion of security and transparency meets modern packaging demands for authenticity and consumer trust.
On the digital front, Holostik will introduce the SureAssure digital authentication application. This app enables consumers to verify product authenticity in real time, fostering trust and strengthening brand protection in an increasingly connected market.
Holostik’s innovative Phygital approach integrates physical security features, such as labels and holograms, with digital technologies like QR codes. This hybrid strategy ensures comprehensive product authentication at the point of sale and throughout the supply chain, setting a new standard for anti-counterfeiting solutions.
In addition to the exhibition, Holostik’s joint managing director, Ankit Gupta, will participate in a panel discussion at the International Packaging Conclave 2025, sharing insights on the future of packaging security and sustainability.
