Thursday, July 23, 2026
AwardsHolostik celebrates dual victory at FIPSA-2025 for sustainable packaging...

Holostik celebrates dual victory at FIPSA-2025 for sustainable packaging excellence

-

Holostik celebrates dual victory at FIPSA-2025 for sustainable packaging excellence

-

Holostik India and NaturTrust have received awards in the Sustainability category at the FIPSA-2025 Responsible Packaging Awards. The awards were presented by the Foundation For Innovative Packaging and Sustainability in collaboration with the National Institute of Design, Madhya Pradesh, under the Ministry of Commerce & Industry, Government of India.

“This double victory feels particularly meaningful because it validates years of dedicated work toward making packaging more responsible. With over 200 entries competing for recognition and an esteemed jury evaluating each submission, these awards represent more than just trophies – they’re proof that our approach to balancing security with sustainability is making a real difference in the industry,” said Ankit Gupta, joint managing director of Holostik.

Gupta added, “This award is a proud moment for Holostik, it is a recognition of our belief that the future of packaging lies at the intersection of security and sustainability. With NaturTrust, we are advancing biodegradable and compostable packaging that safeguards both brands and the planet.”

Through this award-winning work, Holostik continues to empower brands across industries, pharmaceuticals, FMCG, agro, automotive, apparel and more, to adopt solutions that are secure for consumers, smart for businesses, and sustainable for the environment.

NewsDesk
NewsDesk
The editorial team of The Packman who handle all the press releases with Sunil Jain working as the desk editor.

LEAVE A REPLY

Please enter your comment!
Please enter your name here

This site uses Akismet to reduce spam. Learn how your comment data is processed.

Latest news

Romaco India showcases blister packaging and tableting expertise at Hyderabad open house

Romaco India, the Sales & Service Centre of the Romaco Group, hosted a three-day open house at its Experience...

Epson to showcase on-demand color labeling and thermal printing solutions at Foodpro 2026

Epson will demonstrate its on-demand color labeling and thermal receipt printing solutions at Foodpro 2026, a food and beverage...

Herma launches Linerless Plus label material with 62Dps adhesive

Herma has introduced Linerless Plus (400), a linerless label material using the multi-layer pressure-sensitive adhesive 62Dps for the first...

Koenig & Bauer and Siemens collaborate on next-generation software-defined machine architecture

The strategic partnership between Koenig & Bauer and Siemens, initiated one year ago, is progressing according to plan along...
- Advertisement -spot_img

HIPLEX 2026 Roadshow held in Hyderabad

The roadshow for HIPLEX 2026, India’s third-largest plastics exhibition, was held on Saturday night at ITC Kakatiya, Hyderabad, setting...

UFlex secures patent for advanced reclosable packaging for large-format bags

UFlex, India’s largest multinational flexible packaging and solutions company, has secured an Indian patent, valid for a period of...

Must read

Kridwinn to debut at Pamex 2026 with digital innovations

Gurugram (Delhi-NCR)-based Kridwinn will make its debut at Pamex...

Innovia Films launches recyclable film for fresh produce packaging

Innovia Films, a leading material science pioneer and manufacturer...

You might also likeRELATED
Recommended to you