Monday, June 29, 2026
EventsGet label smart at FINAT’s Technical Seminar

Get label smart at FINAT’s Technical Seminar

-

Get label smart at FINAT’s Technical Seminar

-
Chris Ellison, president of Finat

 

[dropcaps style=’2′]The age of smart products is happening now. That is one of the main messages being shared by Andy Hobsbawm at next month’s biennial FINAT Technical Seminar, 7-9 March 2018, in Barcelona.[/dropcaps]

The founder and chief marketing officer of IoT smart products platform EVRYTHNG will give his insight into the technical side of the way smart products can transform brand relationships, business operations, and service experiences. He will also explore how labels and packaging are the digital bridge between the physical product and a cloud-powered universe of real-time data and software applications.

This is just one of the many dynamic, emerging and hugely engaging topics that will be explained, analysed and discussed at this year’s event. Others include the impact of end-to-end connectivity on optimising the production chain, the gains possible with workflow automation, the ways of tackling issues in digital automation and the importance of real-time data collection and communication.

FINAT president Chris Ellison, who will give a presentation on the logical, fool proof way to target processes, print needs and timescales, states, “The seminar has been curated to help companies understand the technical challenges and improve their organisational efficiency, service and profitability by implementing new techniques, methodologies and by employing the workers’ skills and knowledge to the fullest.”

“The papers being presented will show, from a technical standpoint, new features and requirements in printing, converting, and processing that keep the labelling industry moving forward and help to add value in the supply chain. There will also be an update on the latest status with regards to materials science, converting technology as well as application requirements, and the seminar is targeted at all levels of the technical community from research and development or production to technical directors and executives.”

Day two will start with in depth overviews of inks, varnishes, facestocks and finishing, plus recent advances in PSA label films. It will also look more closely at value-added options for labels through the use of hot and cold foiling, embossing, and adding texture. Günther Dieroff, sales and marketing manager for Beneli will close the event by demystifying IoT technologies.

Mahan Hazarika
Mahan Hazarika
Mahan Hazarika is the Editor of The Packman since 2017. Having spent more than a decade reporting on the printing and packaging industries, he brings a wealth of industry knowledge, perspective, and insight to his work. Outside the newsroom, Mahan is passionate about ZG music, travel, and films.

LEAVE A REPLY

Please enter your comment!
Please enter your name here

This site uses Akismet to reduce spam. Learn how your comment data is processed.

Latest news

Blue Ocean Closures unveils fiber-based paper-plug

Blue Ocean Closures has introduced Paper-Plug, a fiber-based opening and dispensing system designed for carton and corrugated board packaging. The...

Pizza Hut wing bowl earns 2026 APR award for recyclable design and food-grade PP innovation

Anchor Packaging and Pizza Hut have received the 2026 Association of Plastic Recyclers (APR) Recycling Leadership Award for Package...

Canpac Trends opens manufacturing facility in Dadri

Canpac Trends has opened a new manufacturing facility in Dadri, Noida, to expand its production capacity and improve service...

Evonik upgrades UV label and release liner coating capabilities in Shanghai

Evonik is strengthening innovation, sustainability, and customer collaboration in the label and release liner industry through an upgrade of...
- Advertisement -spot_img

Winning the new-age consumer – packaging insights from scaling a D2C nutraceutical brand

Speaking at the curtain raiser of Bharat Packaging Expo at the Indian Institute of Packaging (IIP), New Delhi, Sandip...

Beyond recyclability – Siegwerk calls for greater focus on packaging safety in circular economy

At the curtain raiser event for Bharat Packaging Expo held at the Indian Institute of Packaging (IIP), New Delhi,...

Must read

Selig Group showcases pharmaceutical liners at PMEC 2025

Selig Group, a global leader in container sealing and...

Uflex invests in laser scoring technology for flexible packaging solutions

Uflex has recently introduced laser scoring technology in India...

You might also likeRELATED
Recommended to you