Wednesday, September 2, 2026
Industry NewsBobst Group informs about its intention to issue debenture...

Bobst Group informs about its intention to issue debenture bond

-

Bobst Group informs about its intention to issue debenture bond

-
Information call for bond investors will take place on 16 January 2024, at 11 am. Photo: The Packman

For 2023, Bobst Group is currently expecting full-year sales to be higher than the level reached in 2022 (2022 CHF 1 841 million). The full-year operating result (EBIT) margin will be slightly lower than in 2022 (7.7%).

For 2024, the Group expects sales and operating results (EBIT) to be lower than the values reached in 2022.

Bobst Group also intends to issue a debenture bond. The proceeds will be used to reimburse the CHF 135 million debenture bond maturing on September 27, 2024, and for general corporate purposes.

Information call for bond investors will take place on 16 January 2024, at 11 am.

NewsDesk
NewsDesk
The editorial team of The Packman who handle all the press releases with Sunil Jain working as the desk editor.

LEAVE A REPLY

Please enter your comment!
Please enter your name here

This site uses Akismet to reduce spam. Learn how your comment data is processed.

Latest news

Flint Group Digital Xeikon partners with Xerox on digital press distribution

Flint Group Digital Xeikon (FGDX) has entered a strategic partnership with Xerox Holdings Corporation. Under the collaboration, Xerox will...

Echaar targets short-run opportunity with Flexocompact CI flexo

The economics of flexible packaging are changing, particularly at the shorter end of the run-length spectrum. For converters handling...

Pratip Samanta on AI, openness and the future of machine automation

In this interview with The Packman, Pratip Samanta, regional managing director – Southern & Eastern Asia, ABB Machine Automation...

Ester Industries looks beyond compliance to build circularity at scale

Vaibhav Jha, CEO of Ester Industries, used his presentation at the 13th Specialty Films & Flexible Packaging Global Summit...
- Advertisement -spot_img

Yangi to showcase Cellera dry-forming platform at Pack Expo International 2026

Yangi, the Swedish developer of Cellera dry-forming technology for fiber-based packaging, is entering the U.S. market with its quick-serve...

Brilliant Polymers pushes the solvent-free advantage

For Brilliant Polymers, the case for solvent-free lamination is becoming increasingly straightforward: sustainability has to make commercial sense too....

Must read

Param at PrintPack | Hall 3 Stand B-6

At PrintPack 2017, Indore-based Param ERP will be present...

Bobst launches Packaging Forward to engage packaging professionals

Bobst North America will host Packaging Forward, a new...

You might also likeRELATED
Recommended to you