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Holostik excels at 29th Rice Grain Pro-Tech Expo 2024

NewsDesk -
Holostik, a leading provider of secure and smart packaging solutions, made a notable impact on the opening day of the 29th International Rice Grain...

Zircon finalizes five DCM systems from FIG

NewsDesk -
Dehradun-based Zircon Industries, a prominent provider of comprehensive label and packaging solutions customized to meet diverse brand requirements, has made a significant announcement at...

Epson India showcases advanced digital printing solutions at Labelexpo India 2024

Mahan Hazarika -
At Labelexpo India 2024, Epson India unveiled its flagship UV press, the SurePress L-6534VW, marking its formal introduction to the Indian market. “The primary...

Monotech unveils JETSCI KolorSmart+ UV inkjet label production press

NewsDesk -
Monotech Systems has showcased its JETSCI KolorSmart+ UV inkjet label production press at Labelexpo India 2024. With over 15 installations globally, the label printing...

HP at Labelexpo India 2024 – pioneering digital printing innovations

Mahan Hazarika -
At Labelexpo India 2024, HP had a robust display of its digital printing solutions and technologies aimed at transforming the label and packaging industry....

Barcom gets two more Mark Andy presses from FIG

NewsDesk -
Since its incorporation in 2002, Mumbai-based Barcom Industries has been closely associated with Flexo Image Graphics (FIG), which supplied and installed many of the...

UFlex reports 10.9% YoY sales volume growth in Q2 FY25

NewsDesk -
UFlex, India's largest integrated multinational flexible packaging and solutions company, reported second quarter fiscal 2025 unaudited consolidated net revenue of Rs. 38,532 million. Normalized...

Harveer Sahni unveils Untold Stories of Indian Label Industry at Labelexpo India 2024

Mahan Hazarika -
At Labelexpo India 2024, industry veteran Harveer Sahni unveiled his much-anticipated book, Untold Stories of Indian Label Industry. The book, launched at the HP...
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Labels

Avery Dennison integrates Pragmatic Semiconductor’s chip on a mass scale

Avery Dennison is enhancing its Near Field Communication (NFC) inlay portfolio with a flexible integrated circuit (FlexIC) product line, NFC Connect, from Pragmatic Semiconductor. The...
Industry News

Elephant wins the A’ Design Award for Himalaya Wellness packaging design

Elephant, a leading design agency, has won the coveted A’ Design Award – Silver in the ‘Packaging Design category’ for their packaging for Himalaya...
Flexibles

SRF to install fourth Bobst metallizer in 2026

Building on its continued expansion in metalizing capacity, SRF has invested in a fourth Bobst metallizer – this time for its Indian plant. The...
Food Packaging

Ipack-Ima and Pharmintech 2025 open with global focus on innovation and sustainability

On 27 May 2025, the bustling halls of Fiera Milano exhibition centre opened their doors to commence Ipack-Ima, a prominent event showcasing the latest...
Industry News

PulPac ramp up US expansion and announces new tooling partner in Tek Pak

Swedish packaging company, PulPac, ramps up its US expansion with tooling partner Tek Pak. Earlier this year, the Swedes announced they are setting up...

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