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Michelman’s Pack Ready for labels technology at Dscoop EMEA

Visitors at the upcoming Dscoop’s Unleashing Print conference in Vienna, Austria will be introduced to Pack Ready for Labels and Michelman’s suite of pre-...

FachPack is back, bigger

When FachPack, the European trade fair for packaging, processing and technology, opens its doors again for three days on 25 September 2018, 1,500 exhibitors...

Esko, AVT, X-Rite and Pantone create ‘Right First Time’ workflow

Esko has joined forces with Danaher sister companies AVT, X-Rite and Pantone to integrate its automation and collaboration solutions, with the X-Rite and Pantone...

Huhtamaki-PPL Webtech at InnoPack Pharma Confex

Huhtamaki-PPL Webtech division participated in the recent InnoPack Pharma Confex held in Mumbai on 24 and 25 May 2018. The event focuses on various...

TSC to launch latest innovations at COMPUTEX 2018

TSC Auto ID, a global leading manufacturer of innovative thermal label printers for industrial, desktop and mobile applications in the AIDC industry, together with...

‘Think Out Of The Box’ – Heidelberg shows packaging solutions for the digitized future

In the middle of May, more than 400 guests from all over the world attended the Packaging Day hosted by Heidelberger Druckmaschinen AG (Heidelberg)...

Trelleborg’s offset blanket solutions for packaging industry

  Trelleborg’s printing solutions operation will be attending the forthcoming ProPak Asia event, 13 – 16 June, with its range of Sava offset blanket solutions...

Printpack India 2019 sets stage for a record-setting edition

The Indian Printing Packaging & Allied Machinery Manufacturers’ Association (IPAMA) has received more than 300 confirmed bookings of space as on 22 May 2018...

Must Read

Bosch presents track and trace solutions at interpack 2017

At interpack 2017, Bosch Packaging Technology shows how Industry 4.0 solutions help to achieve higher process safety and product quality. “Especially in the pharmaceutical...

Comexi’s F2 ML flexo press and laser technology at interpack

Comexi, specialist in solutions for the flexible packaging industry, will be presenting its wide range of printing and converting solutions at interpack 2017. At...

Smart packaging, green future – swop 2025

Shanghai World of Packaging (swop) will return to the Shanghai New International Expo Centre from 25 to 27 November 2025, to mark a decade...

The Rubber Street at K 2025

From 8 to 15 October 2025, K in Düsseldorf will once again be the central meeting point for the global plastics and rubber industry....

Huhtamaki’s first India edition of Think Circle

Huhtamaki India organized the first India edition of its Think Circle. The forum facilitates an open discussion on the issues, challenges, and opportunities faced...