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Tilia Labs to show Phoenix 7.0 software for label production at Labelexpo Americas

Mahan Hazarika -
At Labelexpo Americas 2018 in Chicago from 25 – 27 September, Tilia Labs, a leading developer of planning, imposition, and automation software solutions for...

First edition of World of Labeling by ALPS concludes successfully

Mahan Hazarika -
Association of Label Printers and Suppliers (ALPS) successfully conducted the first edition of its World of Labeling (WoL) seminar on 10 August 2018 in...

Bobst to focus on productivity and performance at CCE South East Asia 2018

Mahan Hazarika -
A watchword for excellence in the packaging machine industry, Bobst has announced its key focuses for this year’s Corrugated and Carton Exhibition (CCE) South...

Kodak launches the Global Flexo Innovation Awards 2018

Mahan Hazarika -
Kodak is celebrating the 10th anniversary of its KODAK FLEXCEL NX Systemby launching the ‘Kodak Global Flexo Innovation Awards.’ Since 2008, the FLEXCEL NX...

Koch focuses on Indian blister packaging market

Mahan Hazarika -
  At PackPlus 2018 from 25 to 28 July in Delhi, Koch Pac-Systeme was busy in brand building and promoting its packaging solutions. "India is...

APL plans to manufacture LED UV systems in India with AMS

Mahan Hazarika -
Faridabad-based APL Machinery, a leading manufacturer, supplier and exporter of printing machines including UV LED curing equipment, displayed different curing systems at PackPlus Delhi....

PackPlus 2018 records huge success

Mahan Hazarika -
The total packaging, processing & supply chain event, held from 25-28 July 2018 at PragatiMaidan, New Delhi, recorded huge success with a footfall of...

PackPlus 2018: Konica Minolta shows how to grow with your customer

Mahan Hazarika -
  At PackPlus 2018, Konica Minolta came up with a unique way of engaging with its customers by marketing customers’ print samples. The aim was...
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swop 2025 unveils packaging solutions matrix

Accelerating sustainability, rising digitalization and shifting consumer behavior are reshaping the packaging industry. As a member of the interpack alliance, swop deeply explores cutting-edge...
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Koenig & Bauer gathers a diversity of packaging print solutions

The trade show Pack Print International, which is organised by Messe Düsseldorf Asia, will be returning to the Bangkok Trade & Exhibition Centre for...
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JETSCI Global at Labelexpo India 2022

JETSCI Global will showcase several digital label printing solutions at Labelexpo India 2022. The company will also run live demonstrations of its new Colornovo...
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Esko India closes two Kongsberg table deals at IndiaCorr Expo 2019

Esko India closed two deals for its Kongsberg table and ArtiosCAD 3D software during SinoCorrugated-IndiaCorr Expo 2019, held at India Exposition Mart, Greater Noida,...
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Bosch showcases scalable cookie and cracker packaging systems

At interpack 2017, Bosch Packaging Technology will debut scalable packaging systems for sweet and savoury biscuits for slug and pile pack (Hall 6 Stand...

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