Avery Dennison introduced their new Surfas Technology at Labelexpo Europe 2019. This patent-pending adhesive technology increases surface contact for better initial tack to create...
Baldwin has announced its participation at K 2019, Dusseldorf, 16-23 October. At Stand C53, Hall 4, Baldwin Technology will showcase cleaning, surface treatment, coating...
The global metal packaging industry will be convening at the Essen exhibition center between 5-9 May 2020. MetPack will be bringing together high-ranking, international...
Esko India closed two deals for its Kongsberg table and ArtiosCAD 3D software during SinoCorrugated-IndiaCorr Expo 2019, held at India Exposition Mart, Greater Noida,...
Bossar will present the new CleanPouch Portfolio for food and beverage applications together with its sister group company Scholle IPN.
Bossar’s state-of-the-art modular Horizontal Form-Fill...
The 9th Speciality Film and Flexible Packaging Global Summit by ElitePlus Business Services held on 5-6 September 2022 in Mumbai attracted over 1,600 delegates...
Konica Minolta Business Solutions India, participated as the Platinum Exclusive Sponsor of the first-ever Digital Print Asia Summit 2025, held on 21–22 August 2025...