H.B. Fuller has launched its first filled hot melt pressure sensitive adhesive (PSA) to address tape and label die-cutting challenges. The new Swiftmelt 1401-I...
Returning after four years, Labelexpo India 2022, South Asia’s leading exhibition for the labels and packaging printing industry, started on 10 November 2022 and...
Mahan Hazarika: Please tell us about the partnership. What are the advantages/benefits of the partnership?
Priyatosh Kumar, HOD, GA division, Fujifilm India: Fujifilm’s GTM (Go...
Domino’s N610i integration module, based on Generation 6 technology and with nearly 1,000 installations worldwide, combines digital with analog printing and finishing capabilities such...
At Labelexpo India 2022, HP Indigo in collaboration with Technova Imaging Solutions will present new printing solutions for growing and differentiating labels and packaging...