The annual International Packaging Conclave will take place on 4 August 2017 at Pragati Maidan, New Delhi. Organized by Print-Packaging.com in association with Siegwerk...
PackPlus Delhi 2017 is expected to witness more than 80 product launches.Uflex Engineering will offer high speed solventless lamination machine, high speed slitting machine...
Building on the previous year’s success, PackPlus is back this year, continuing its trend of 30% sustained growth over the past four editions. Featuring...