The global biscuit and confectionery company pladis has signed a preferred supplier agreement with Bosch Packaging Technology at interpack 2017. By signing the agreement,...
At interpack 2017, HP Inc. announced commercial availability of HP Indigo Pack Ready Lamination, allowing immediate time-to-market for flexible packaging. A pioneering technology, Pack...
The eagerly awaited interpack 2017 has commenced at Messe Düsseldorf, Germany. The show, which runs from 4-10 May, has recorded the highest demand among...