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Nestlé makes further headway in shaping a waste-free future

NewsDesk -
Nestlé has made considerable progress in reducing its packaging, creating better packaging, and improving waste management. Since signing up to the Global Commitment on...

Koenig & Bauer and Durst Group commit to further capabilities in joint venture

NewsDesk -
Koenig & Bauer and Durst Group have committed to building further R&D capability in the joint venture company they set up almost five years...

Syntegon showcases turnkey solutions for the confectionery industry at ProSweets

NewsDesk -
At the ProSweets event, Syntegon is spotlighting its comprehensive capabilities in the confectionery industry, spanning kitchen, depositing, finishing technologies, and packaging solutions at Stand...

Edale and DuPont’s Ahmedabad seminar unveils new era in carton production

Manash Das -
In a collaborative effort, Edale and DuPont recently hosted a seminar ‘Game-changing single-pass carton production’ in Ahmedabad on 1 December 2023. The event delved...

VDMA’s Mumbai conference forecasts a boost for circular economy in 2025

Manash Das -
In Mumbai, a one-day conference hosted by VDMA – the German association of mechanical and plant engineering companies – successfully convened representatives from top-tier...

drupa 2024 preview tour lights up Mumbai, Delhi and Chennai

Manash Das -
The countdown for drupa 2024 is on. In the run-up to drupa, the number one trade fair for printing technologies scheduled from 28 May...

B&R launches online community

NewsDesk -
B&R has launched its new digital public platform, the B&R Community. The AI-enhanced online community is designed to empower all users of B&R’s Industrial...

Kodak to present innovative solutions for printers at Pamex 2024

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At Pamex 2024, taking place at the Bombay Exhibition Center in Mumbai from 6 to 9 February 2024, Kodak is set to showcase its...
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At the Flexo Forward conference, jointly organized by apex International, Miraclon, Bobst, and Polymount in Ahmedabad (5 June 2026), industry experts gathered to discuss...
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Seiko Instruments presents its new RCE2560 printhead at drupa 2024

Seiko Instruments’ printhead division will unveil its highly anticipated 600 dpi printhead – RCE2560 – at drupa 2024. The RCE2560 stems from its groundbreaking...
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Heidelberg shows end-to-end packaging solution in China for Asian market

Heidelberg hosted its Packaging Day at Qingpu factory under the theme, ‘Infinite Possibilities-Smart Production’, in September 2019. Over a hundred visitors from all over...
Labels

Ankit Graphics targets wide-web packaging with Esko Quartz

Ahmedabad-based flexo pre-press trade shop Ankit Graphics is strengthening its plate-making capabilities with an investment in Esko CDI Crystal Quartz technology in the 4260...

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