From 2024, the Shanghai World of Packaging (swop) is set to become an annual event. As part of the interpack alliance, this trade fair is placing increased emphasis on meeting the specific needs of the local market and fostering stronger international connections within the processing and packaging industry.
Even before the start of swop 2023, it was clear that the trade fair will already be held again in 2024. One reason is the growing demand from exhibitors and visitors. The shorter cycles of innovation which result from the change in the packaging industry and which especially affect sustainability and digitalization also play a role here. The annual rhythm creates a platform to present innovations and developments in the processing and packaging segment in a timely manner. Until now, the rhythm was two years.
“With this step, we recognize the needs of the very dynamic Chinese packaging market,” says Thomas Dohse, director of the interpack alliance. “A shorter interval between events has been met here with great interest. Regular participation allows companies to increase their visibility, improve customer retention and strengthen their position in the market.”
A perspective on future topics
swop covers a great range of topics, among them artificial intelligence, sustainable packaging, smart factory, printing and labeling, processing and packaging components, manufacture of packaging containers, e-commerce and shipping packages, packaging materials and design as well as personalized packaging. Users receive innovative omnichannel packaging solutions and intelligent processing and packaging production guidelines. This is complemented by an extensive supporting programme and special areas.
The next dates
From 22 – 24 November 2023, swop will be held in Shanghai. Around 700 exhibitors and 25,000 visiting professionals from China and abroad are expected. In 2024, swop is scheduled for 18 – 20 November, and will also take place in Shanghai.